本发明揭示设备和形成该设备的方法，该设备包括形成在基板设备的基板中的孔穴，该基板设备亦包括形成在该基板中的导电通孔。芯片设备、晶圆和其他基板设备可被安装至该基板设备。囊封层和材料可被形成在该基板设备上方；以填充该孔穴。

A device and method of forming the device that includes cavities formed in a substrate of a substrate device, the substrate device also including conductive vias formed in the substrate. Chip devices, wafers, and other substrate devices can be mounted to the substrate device. Encapsulation layers and materials may be formed over the substrate device in order to fill the cavities.