本发明提供一种处理互连组件的方法，其包含提供一基板组件，该基板组件具有反向的前表面与后表面以及导电结构；一叠置在该前表面上方的第一介电层并且在该第一介电层的一第一表面处有复数个导体接点；以及一叠置在该后表面上方的第二介电层并且在该第二介电层的一第二表面处有一导体组件。该方法还会包含移除该第二介电层的一部分，以便将该部分的厚度缩减至一第二厚度，并且用以提供该第二介电层的一具有第一厚度的隆起部分以及一具有第二厚度的下降部分。该第一厚度会大于该第二厚度。该导体组件的至少一部分会凹陷至该第二介电层的该第一厚度的高度之下。

A method of processing an interconnection element can include providing a substrate element having front and rear opposite surfaces and electrically conductive structure, a first dielectric layer overlying the front surface and a plurality of conductive contacts at a first surface of the first dielectric layer, and a second dielectric layer overlying the rear surface and having a conductive element at a second surface of the second dielectric layer. The method can also include removing a portion of the second dielectric layer so as to reduce the thickness of the portion, and to provide a raised portion of the second dielectric layer having a first thickness and a lowered portion having a second thickness. The first thickness can be greater than the second thickness. At least a portion of the conductive element can be recessed below a height of the first thickness of the second dielectric layer.