本发明关于一种电气接点用之护套材料，其系对于由Cu系的析出型时效硬化材所成之基材，接合由Ag合金所成之接点材料而成的电气接点用之护套材料，其特征为：前述接点材料与前述基材之接合界面中的包含Ag及Cu的扩散区域之宽度为2.0μm以下。此护套材料系借由将预先施有溶体化处理及时效硬化的基材与接点材料予以接合而制造，而抑制接合后扩散区域扩大。依照本发明，可在不损害Cu系析出型时效硬化材所具有的特性下，得到能达成高导电率的电气接点。

A clad material for electric contact, including a substrate composed of a Cu-based precipitation-age-hardened material and a contact material made of a Ag alloy to be bonded to the substrate. The substrate is characterized in that a diffused region containing Ag and Cu has a width of 2.0 [mu]m or less on a bonded interface between the contact material and the substrate. The clad material is manufacture by having a substrate, which is preliminarily subjected to solution treatment and age hardening, and a contact material bonded, thereby inhibiting a diffused region from spreading after bonding. The clad material allows high electric conductivity to be achieved without impairing the strength of the substrate.