- 专利标题： Composite electronic component, board having the same, and power smoother including the same
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申请号： US14732667申请日： 2015-06-05
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公开(公告)号： US10008340B2公开(公告)日： 2018-06-26
- 发明人: Young Ghyu Ahn , Byoung Hwa Lee , Sang Soo Park , Oh Choon Kwon , Hong Kyu Shin , Hyun Sub Oh , Jae Hyuk Choi
- 申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： NSIP Law
- 优先权： KR10-2014-0090639 20140717; KR10-2014-0136013 20141008
- 主分类号： H01G15/00
- IPC分类号： H01G15/00 ; H01G4/38 ; H01G4/30 ; H01G9/15 ; H01G9/012 ; H02M1/08 ; H01G4/40 ; H01G9/28 ; H01G2/10 ; H01G4/232 ; H01G4/12 ; H01G9/042 ; H02M3/335 ; H05K1/18
摘要：
A composite electronic component includes a composite body formed by combining a multilayer ceramic capacitor (MLCC) and a tantalum capacitor. The composite electronic component has an excellent acoustic noise reduction effect, low equivalent series resistance (ESR)/equivalent series inductance (ESL), enhanced DC-bias characteristics, and a reduced chip thickness.
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