公开(公告)号：US11521801B2

公开(公告)日：2022-12-06

申请号：US16877913

申请日：2020-05-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Ho Hong ,  Youn Soo Kim ,  Oh Choon Kwon ,  Hyun Sub Oh

IPC: H01G9/15 ,  H01G9/052 ,  H01G9/00 ,  H01G11/36 ,  H01G11/46 ,  H01G11/48 ,  H01G9/04

Abstract: A solid electrolyte capacitor includes a sintered body formed by sintering a molded body containing metal powder; and a conductive polymer layer disposed above the sintered body. A ratio (t2/t1) of a thickness (t2) of the conductive polymer layer in an edge portion of the sintered body to a thickness (t1) of the conductive polymer layer in a central portion of the sintered body satisfies 0.35≤t2/t1≤0.9.

公开(公告)号：US20210166886A1

公开(公告)日：2021-06-03

申请号：US16877913

申请日：2020-05-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Ho Hong ,  Youn Soo Kim ,  Oh Choon Kwon ,  Hyun Sub Oh

IPC: H01G9/052 ,  H01G9/00 ,  H01G11/48 ,  H01G11/36 ,  H01G11/46

Abstract: A solid electrolyte capacitor includes a sintered body formed by sintering a molded body containing metal powder; and a conductive polymer layer disposed above the sintered body. A ratio (t2/t1) of a thickness (t2) of the conductive polymer layer in an edge portion of the sintered body to a thickness (t1) of the conductive polymer layer in a central portion of the sintered body satisfies 0.35≤t2/t1≤0.9.

公开(公告)号：US10008340B2

公开(公告)日：2018-06-26

申请号：US14732667

申请日：2015-06-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ghyu Ahn ,  Byoung Hwa Lee ,  Sang Soo Park ,  Oh Choon Kwon ,  Hong Kyu Shin ,  Hyun Sub Oh ,  Jae Hyuk Choi

IPC: H01G15/00 ,  H01G4/38 ,  H01G4/30 ,  H01G9/15 ,  H01G9/012 ,  H02M1/08 ,  H01G4/40 ,  H01G9/28 ,  H01G2/10 ,  H01G4/232 ,  H01G4/12 ,  H01G9/042 ,  H02M3/335 ,  H05K1/18

CPC classification number: H01G15/00 ,  H01G2/106 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H01G4/40 ,  H01G9/012 ,  H01G9/042 ,  H01G9/15 ,  H01G9/28 ,  H02M1/08 ,  H02M3/33507 ,  H05K1/181 ,  H05K2201/10015 ,  Y02B70/1433

Abstract: A composite electronic component includes a composite body formed by combining a multilayer ceramic capacitor (MLCC) and a tantalum capacitor. The composite electronic component has an excellent acoustic noise reduction effect, low equivalent series resistance (ESR)/equivalent series inductance (ESL), enhanced DC-bias characteristics, and a reduced chip thickness.