Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US15298746Application Date: 2016-10-20
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Publication No.: US10008575B2Publication Date: 2018-06-26
- Inventor: Dong Chan Suh , Yong Suk Tak , Gi Gwan Park , Mi Seon Park , Moon Seung Yang , Seung Hun Lee , Poren Tang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey, & Pierce, P.L.C.
- Priority: KR10-2016-0010528 20160128
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/08 ; H01L29/66 ; H01L29/78 ; H01L23/528 ; H01L29/06

Abstract:
A semiconductor device includes at least a first wire pattern, a gate electrode, a semiconductor pattern, a gate insulating layer, and a first spacer. The first wire pattern is on a substrate and isolated from the substrate. The gate electrode surrounds and intersects the first wire pattern. The semiconductor pattern is on both sides of the first wire pattern, and the semiconductor pattern includes a portion which overlaps the first wire pattern. The gate insulating layer is disposed between the gate electrode and the first wire pattern, and the gate insulating layer surrounds the first wire pattern. The first spacer is between the first wire pattern and the substrate, and the first spacer is between the gate insulating layer and the semiconductor pattern.
Public/Granted literature
- US20170222006A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2017-08-03
Information query
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