- 专利标题: Tungsten gates for non-planar transistors
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申请号: US15726609申请日: 2017-10-06
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公开(公告)号: US10020375B2公开(公告)日: 2018-07-10
- 发明人: Sameer S. Pradhan , Daniel B. Bergstrom , Jin-Sung Chun , Julia Chiu
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Green, Howard & Mughal LLP
- 主分类号: H01L29/49
- IPC分类号: H01L29/49 ; C23C14/06 ; H01L21/28 ; H01L21/8238 ; H01L29/66 ; H01L27/092 ; H01L29/40 ; H01L29/417 ; H01L23/522 ; H01L29/78
摘要:
The present description relates to the field of fabricating microelectronic devices having non-planar transistors. Embodiments of the present description relate to the formation of gates within non-planar NMOS transistors, wherein an NMOS work-function material, such as a composition of aluminum, titanium, and carbon, may be used in conjunction with a titanium-containing gate fill barrier to facilitate the use of a tungsten-containing conductive material in the formation of a gate electrode of the non-planar NMOS transistor gate.
公开/授权文献
- US20180047825A1 TUNGSTEN GATES FOR NON-PLANAR TRANSISTORS 公开/授权日:2018-02-15
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