Invention Grant
- Patent Title: Tungsten gates for non-planar transistors
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Application No.: US15726609Application Date: 2017-10-06
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Publication No.: US10020375B2Publication Date: 2018-07-10
- Inventor: Sameer S. Pradhan , Daniel B. Bergstrom , Jin-Sung Chun , Julia Chiu
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Green, Howard & Mughal LLP
- Main IPC: H01L29/49
- IPC: H01L29/49 ; C23C14/06 ; H01L21/28 ; H01L21/8238 ; H01L29/66 ; H01L27/092 ; H01L29/40 ; H01L29/417 ; H01L23/522 ; H01L29/78

Abstract:
The present description relates to the field of fabricating microelectronic devices having non-planar transistors. Embodiments of the present description relate to the formation of gates within non-planar NMOS transistors, wherein an NMOS work-function material, such as a composition of aluminum, titanium, and carbon, may be used in conjunction with a titanium-containing gate fill barrier to facilitate the use of a tungsten-containing conductive material in the formation of a gate electrode of the non-planar NMOS transistor gate.
Public/Granted literature
- US20180047825A1 TUNGSTEN GATES FOR NON-PLANAR TRANSISTORS Public/Granted day:2018-02-15
Information query
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