Invention Grant
- Patent Title: Sidewall passivation for HEMT devices
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Application No.: US15613660Application Date: 2017-06-05
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Publication No.: US10020376B2Publication Date: 2018-07-10
- Inventor: Han-Chin Chiu , Chi-Ming Chen , Cheng-Yuan Tsai , Fu-Wei Yao
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L23/29 ; H01L29/78 ; H01L29/20 ; H01L29/205 ; H01L29/778 ; H01L21/02 ; H01L23/31 ; H01L29/10

Abstract:
Some embodiments of the present disclosure relate to a high electron mobility transistor (HEMT) which includes a heterojunction structure arranged over a semiconductor substrate. The heterojunction structure includes a binary III/V semiconductor layer made of a first III-nitride material to act as a channel region of the e-HEMT, and a ternary III/V semiconductor layer arranged over the binary III/V semiconductor layer and made of a second III-nitride material to act as a barrier layer. Source and drain regions are arranged over the ternary III/V semiconductor layer and are spaced apart laterally from one another. A gate structure is arranged over the heterojunction structure and is arranged between the source and drain regions. The gate structure is made of a third III-nitride material. A first passivation layer is disposed about sidewalls of the gate structure and is made of a fourth III-nitride material.
Public/Granted literature
- US20170271473A1 SIDEWALL PASSIVATION FOR HEMT DEVICES Public/Granted day:2017-09-21
Information query
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