Invention Grant
- Patent Title: Apparatus and method for treating a substrate
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Application No.: US15363062Application Date: 2016-11-29
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Publication No.: US10032657B2Publication Date: 2018-07-24
- Inventor: Jaeyong Kim
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheo, Ngnam-Do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheo, Ngnam-Do
- Agency: Carter, Deluca, Farrell & Schmidt, LLP
- Priority: KR10-2015-0169337 20151130
- Main IPC: H01L21/67
- IPC: H01L21/67 ; G03F7/16 ; G03F7/20

Abstract:
The present disclosure relates to an apparatus and a method for treating a substrate with a liquid. A substrate treating apparatus includes a substrate supporting unit having a supporting plate for supporting a substrate and a bottom liquid supply unit for supplying a liquid to a bottom of the substrate supported by the supporting plate, wherein the bottom liquid supply unit includes a body and a liquid discharge nozzle for discharging a treatment liquid to the bottom of the substrate and coupled to the body and wherein an upper surface of the body includes a drainage hole for draining a liquid remaining in the body. Accordingly a liquid remained in the body may be discharged through the drainage hole.
Public/Granted literature
- US20170153550A1 APPARATUS AND METHOD FOR TREATING A SUBSTRATE Public/Granted day:2017-06-01
Information query
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