公开(公告)号：US11171019B2

公开(公告)日：2021-11-09

申请号：US15858120

申请日：2017-12-29

Applicant: SEMES CO., LTD.

Inventor： Jaeyong Kim ,  Raetaek Oh ,  Taekyoub Lee

IPC: H01L21/02 ,  H01L21/67 ,  G01F23/00 ,  B08B3/04

Abstract: Disclosed are an apparatus and a method for treating a substrate. The substrate treating apparatus includes a flow rate measuring unit includes a container located outside the housing and having an accommodation space an upper side of which is opened and in which the treatment liquid discharged from the treatment liquid nozzle is accommodated, in the interior thereof, a measurement member configured to measure an amount of the treatment liquid accommodated in the accommodation space, and a drain line through which the treatment liquid in the container is discharged.

公开(公告)号：US10032657B2

公开(公告)日：2018-07-24

申请号：US15363062

申请日：2016-11-29

Applicant: SEMES CO., LTD.

Inventor： Jaeyong Kim

IPC: H01L21/67 ,  G03F7/16 ,  G03F7/20

Abstract: The present disclosure relates to an apparatus and a method for treating a substrate with a liquid. A substrate treating apparatus includes a substrate supporting unit having a supporting plate for supporting a substrate and a bottom liquid supply unit for supplying a liquid to a bottom of the substrate supported by the supporting plate, wherein the bottom liquid supply unit includes a body and a liquid discharge nozzle for discharging a treatment liquid to the bottom of the substrate and coupled to the body and wherein an upper surface of the body includes a drainage hole for draining a liquid remaining in the body. Accordingly a liquid remained in the body may be discharged through the drainage hole.