- Patent Title: Semiconductor device package and method of manufacturing the same
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Application No.: US15416907Application Date: 2017-01-26
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Publication No.: US10037974B2Publication Date: 2018-07-31
- Inventor: Chien Lin Chang Chien , Chang Chi Lee , Chin-Li Kao , Dao-Long Chen , Ta-Chien Cheng
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L21/56 ; H01L21/78 ; H01L23/31 ; H01L23/367 ; H01L23/00 ; H01L25/00
Abstract:
A semiconductor device package includes a package substrate, a first electronic device, a second electronic device and a first molding layer. The package substrate includes a first surface, a second surface opposite to the first surface, and an edge. The first electronic device is positioned over and electrically connected to the package substrate through the first surface. The second electronic device is positioned over and electrically connected to the first electronic device. The first molding layer is positioned over the package substrate, and the first molding layer encapsulates a portion of the first surface and the edge of the package substrate.
Public/Granted literature
- US20170263589A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-09-14
Information query
IPC分类:
