Invention Grant
- Patent Title: Method of measuring thickness, method of processing image and electronic system performing the same
-
Application No.: US15252613Application Date: 2016-08-31
-
Publication No.: US10055829B2Publication Date: 2018-08-21
- Inventor: Min-Chul Park , Je-Hyun Lee , Jeong-Hoon Ko , Young-Gu Kim , Keun-Ho Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, PLC
- Priority: KR10-2015-0144096 20151015
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06T7/62 ; G06T5/00 ; G06T7/12

Abstract:
A thickness of a first layer in a structure may be measured based on an original image of the structure. A first boundary of the first layer may be identified in the original image. A second boundary that is substantially indistinguishable in the original image may be identified based on converting the original image into a first image based on the first boundary and generating a second image based on filtering the first image. The first image may be generated based on adjusting partial image portions of the original image to align the representation of the first boundary with an axis line, such that the first image includes a representation of the first boundary that extends substantially in parallel with the axis line. The second boundary may be identified from the second image, and the thickness of the layer may be determined based on the identified first and second boundaries.
Public/Granted literature
- US20170109896A1 METHOD OF MEASURING THICKNESS, METHOD OF PROCESSING IMAGE AND ELECTRONIC SYSTEM PERFORMING THE SAME Public/Granted day:2017-04-20
Information query