Wafer measurement apparatus, wafer measurement system, and method of manufacturing semiconductor device using the same

    公开(公告)号:US10790200B2

    公开(公告)日:2020-09-29

    申请号:US16236761

    申请日:2018-12-31

    IPC分类号: H01L21/66 G01B15/00

    摘要: A wafer measurement system for measuring a measurable characteristic of a first measurement target formed on a wafer includes: a memory and a processor. The memory is configured to store an image of the wafer, multiple templates each including at least one line, and a measurement program. The processor is accessible to the memory and is configured to execute multiple modules included in the measurement program. The modules include: a template selection module configured to receive the templates and select a measurement template corresponding to a shape of the first measurement target; a template matching module configured to match the measurement template to the first measurement target; and a measurement module configured to measure the measurable characteristic of the first measurement target based on position information of the measurement template.