Invention Grant
- Patent Title: Joining to aluminum
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Application No.: US14909888Application Date: 2014-08-29
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Publication No.: US10065274B2Publication Date: 2018-09-04
- Inventor: Ranjit Pandher , Bawa Singh , Rahul Raut , Sanyogita Arora , Ravindra Bhatkal , Bin Mo
- Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
- Agency: Carmody Torrance Sandak & Hennessey LLP
- International Application: PCT/GB2014/052623 WO 20140829
- International Announcement: WO2015/028813 WO 20150305
- Main IPC: B23K35/36
- IPC: B23K35/36 ; B23K35/26 ; B23K35/362 ; B23K35/02 ; B23K1/012 ; B23K1/08 ; B23K1/19 ; C22C13/00

Abstract:
A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.
Public/Granted literature
- US20160175994A1 JOINING TO ALUMINIUM Public/Granted day:2016-06-23
Information query
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