公开(公告)号：US11162007B2

公开(公告)日：2021-11-02

申请号：US16289789

申请日：2019-03-01

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik Ghosal ,  Ranjit Pandher ,  Oscar Khaselev ,  Ravi Bhatkal ,  Rahul Raut ,  Bawa Singh ,  Morgana de Avila Ribas ,  Siuli Sarkar ,  Sutapa Mukherjee ,  Sathish Kumar ,  Remya Chandran ,  Pavan Vishwanath ,  Ashok Pachamuthu ,  Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Nirmalya Kumar Chaki

IPC: C09K5/14 ,  B22F1/00 ,  B22F1/02 ,  C01G5/00 ,  C09C1/62 ,  C09C3/08 ,  B82Y30/00

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

公开(公告)号：US10682732B2

公开(公告)日：2020-06-16

申请号：US15562195

申请日：2016-03-31

Applicant: Alpha Assembly Solutions Inc.

Inventor： Ramakrishna Hosur Venkatagiriyappa ,  Morgana De Avila Ribas ,  Barun Das ,  Harish Hanchina Siddappa ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Bawa Singh ,  Rahul Raut ,  Ranjit Pandher

IPC: C09J163/00 ,  C08L63/00 ,  C08K3/00 ,  C08K3/04 ,  C08K3/34 ,  C08K5/54 ,  C08K9/00 ,  B23K35/36 ,  B23K1/00 ,  B23K35/02 ,  H01L23/29 ,  H01L23/00 ,  C08K5/00 ,  C08K3/013 ,  B23K1/20 ,  C08K7/02 ,  B23K35/00 ,  C08K5/549 ,  B32B27/38 ,  B23K101/42

Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.

公开(公告)号：US20190143461A9

公开(公告)日：2019-05-16

申请号：US15562195

申请日：2016-03-31

Applicant: Alpha Assembly Solutions Inc.

Inventor： Ramakrishna Hosur Venkatagiriyappa ,  Morgana De Avila Ribas ,  Barun Das ,  Harish Hanchina Siddappa ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Bawa Singh ,  Rahul Raut ,  Ranjit Pandher

IPC: B23K35/36 ,  C08K5/549 ,  C08K3/04 ,  B23K35/02 ,  H01L23/00 ,  H01L23/29

Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.

公开(公告)号：US20250026645A1

公开(公告)日：2025-01-23

申请号：US18901595

申请日：2024-09-30

Applicant: Alpha Assembly Solutions Inc.

Inventor： Nirmalyakumar Chaki ,  Supriya Devarajan ,  Barun Das ,  Chetan Pravinchandra Shah ,  Venodh Manoharan ,  Rahul Raut ,  Bawa Singh ,  Ranjit Pandher

IPC: C01B32/194 ,  B29C51/14 ,  B29K67/00 ,  B29K69/00 ,  C08K3/04 ,  C09K5/14 ,  H01B1/04

Abstract: Methods for producing graphene-based products using graphene paste compositions. These methods include producing free-standing graphene foils, films, sheets, polymer supported graphene films, printed graphene structures, graphene features on polymer films, graphene substrates, and graphene metal foils. The methods impart functional characteristics, including corrosion protection and barrier properties to achieve selective enhancement of desired electrical, thermal, mechanical, barrier and other properties.

公开(公告)号：US20240282742A1

公开(公告)日：2024-08-22

申请号：US18582801

申请日：2024-02-21

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghosal ,  Remya Chandran ,  Venodh Manoharan ,  Siuli Sarkar ,  Bawa Singh ,  Rahul Raut

IPC: H01L23/00 ,  B22F1/052 ,  B22F1/07 ,  B22F1/102 ,  B22F5/00 ,  B22F9/24 ,  B23K35/02 ,  B23K35/30 ,  B82Y40/00

CPC classification number: H01L24/29 ,  B22F1/052 ,  B22F1/07 ,  B22F1/102 ,  B22F5/006 ,  B22F9/24 ,  B23K35/025 ,  B23K35/302 ,  B22F2301/10 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2304/058 ,  B82Y40/00

Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.

公开(公告)号：US10065274B2

公开(公告)日：2018-09-04

申请号：US14909888

申请日：2014-08-29

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Ranjit Pandher ,  Bawa Singh ,  Rahul Raut ,  Sanyogita Arora ,  Ravindra Bhatkal ,  Bin Mo

IPC: B23K35/36 ,  B23K35/26 ,  B23K35/362 ,  B23K35/02 ,  B23K1/012 ,  B23K1/08 ,  B23K1/19 ,  C22C13/00

Abstract: A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.

公开(公告)号：US09751159B2

公开(公告)日：2017-09-05

申请号：US15390861

申请日：2016-12-27

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Sanyogita Arora ,  Siuli Sarkar ,  Anna Lifton ,  Rahul Raut ,  Bawa Singh

IPC: B23K35/362 ,  B23K35/36 ,  B23K35/02 ,  C08L93/04 ,  C08K11/00 ,  H05K3/34 ,  B23K101/42

CPC classification number: B23K35/362 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  B23K2101/42 ,  C08K11/00 ,  C08L93/04 ,  C08L2205/025 ,  H05K3/3489

Abstract: Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.

公开(公告)号：US12122679B2

公开(公告)日：2024-10-22

申请号：US17046191

申请日：2019-04-08

Applicant: Alpha Assembly Solutions Inc.

Inventor： Nirmalya Kumar Chaki ,  Supriya Devarajan ,  Barun Das ,  Chetan Pravinchandra Shah ,  Venodh Manoharan ,  Rahul Raut ,  Bawa Singh ,  Ranjit Pandher

IPC: C01B32/194 ,  B29C51/14 ,  B29K67/00 ,  B29K69/00 ,  C08K3/04 ,  C09K5/14 ,  H01B1/04

CPC classification number: C01B32/194 ,  B29C51/14 ,  C08K3/042 ,  C09K5/14 ,  H01B1/04 ,  B29K2067/003 ,  B29K2069/00 ,  C01B2204/04 ,  C01B2204/22 ,  C01B2204/24 ,  C01B2204/32 ,  C08K2201/001 ,  C08K2201/011

Abstract: Methods for producing graphene-based products using graphene paste compositions. These methods include producing free-standing graphene foils, films, sheets, polymer supported graphene films, printed graphene structures, graphene features on polymer films, graphene substrates, and graphene metal foils. The methods impart functional characteristics, including corrosion protection and barrier properties to achieve selective enhancement of desired electrical, thermal, mechanical, barrier and other properties.

公开(公告)号：US11624000B2

公开(公告)日：2023-04-11

申请号：US16616701

申请日：2018-05-22

Applicant: Alpha Assembly Solutions Inc. ,  MacDermid Autotype Limited

Inventor： Nirmalya Kumar Chaki ,  Chetan Pravinchandra Shah ,  Barun Das ,  Supriya Devarajan ,  Siuli Sarkar ,  Rahul Raut ,  Bawa Singh ,  Anubhav Rustogi ,  Anna Jane Harris ,  Keith Paul Parsons ,  Jeffrey William Braham

IPC: C09D11/52 ,  C09D11/033 ,  C09D11/037 ,  C09D11/104 ,  H01H13/704

Abstract: This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.

公开(公告)号：US09786629B2

公开(公告)日：2017-10-10

申请号：US14908986

申请日：2014-07-31

Applicant: Alpha Assembly Solutions Inc.

Inventor： Ramakrishna Hosur Venkatagiriyappa ,  Sutapa Mukherjee ,  Harish Hanchina Siddappa ,  Morgana De Avila Ribas ,  Siuli Sarkar ,  Bawa Singh ,  Rahul Raut

IPC: H01L21/56 ,  H01L23/29 ,  H01L23/00 ,  H01L21/66 ,  H05K3/28 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L22/12 ,  H01L23/293 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/13101 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81026 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2924/0133 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00

Abstract: Dual-side reinforcement (DSR) materials and methods for semiconductor fabrication. The DSR materials exhibit the properties of conventional underfill materials with enhanced stability at room temperature.