- 专利标题: Room-temperature-curable silicone rubber composition, the use thereof, and method for repairing electronic device
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申请号: US15106538申请日: 2014-12-25
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公开(公告)号: US10066138B2公开(公告)日: 2018-09-04
- 发明人: Harumi Kodama , Masayuki Onishi
- 申请人: DOW CORNING TORAY CO., LTD.
- 申请人地址: JP Tokyo
- 专利权人: DOW CORNING TORAY CO., LTD.
- 当前专利权人: DOW CORNING TORAY CO., LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Warner Norcross & Judd LLP
- 优先权: JP2013-272669 20131227
- 国际申请: PCT/JP2014/006473 WO 20141225
- 国际公布: WO2015/098118 WO 20150702
- 主分类号: C08L83/04
- IPC分类号: C08L83/04 ; C09J183/14 ; C09K3/10 ; C08L83/14 ; C08K3/36 ; C08K5/5419 ; C08K5/5435 ; C08K5/57 ; C08L83/00 ; C08G77/50
摘要:
A room-temperature-curable silicone rubber composition which exhibits good adhesion to a substrate contacted during curing and which forms a silicone rubber cured product that can be efficiently peeled is disclosed. The room-temperature-curable silicone rubber composition comprises: (A) an organopolysiloxane having in each molecule at least two specified alkoxysilyl-containing groups on silicon atoms in the molecular chain, (B) a diorganodialkoxysilane or partially hydrolyzed condensate thereof, and (C) a condensation-reaction catalyst.
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