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8 条记录 (耗时 0.037 秒)

    Thermally conductive silicone composition and electrical/electronic apparatus
    1.
    发明授权
    Thermally conductive silicone composition and electrical/electronic apparatus 有权

    公开(公告)号：US10150902B2

    公开(公告)日：2018-12-11

    申请号：US15302555

    申请日：2015-03-26

    申请人： Dow Corning Toray Co., Ltd.

    发明人： Tomoko Kato ,  Harumi Kodama ,  Masayuki Onishi

    IPC分类号： C09K5/10 ,  C08L83/14 ,  H01L23/373 ,  C08L83/06 ,  H01L23/42 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38

    摘要： Provided are a thermally conductive silicone composition excelling in heat resistance and thermal conductivity, in which thickening in an uncured state is suppressed, and which has excellent handling ease; and an electrical/electronic apparatus in which the thermally conductive silicone composition is used as a member.The thermally conductive silicone composition comprises (A) 100 parts by mass of either i) (a1) an organopolysiloxane having, in each molecule thereof, at least one alkoxysilyl-containing group bonded to a silicon atom and expressed by the general formula: and as generally described herein, or ii) a mixture of component (a1) and (a2) an organopolysiloxane having in each molecule thereof, at least two alkenyl groups but not the alkoxysilyl-containing group. In the mixture, the content of component (a1) is 10 to less than 100 mass %. The thermally conductive silicone composition further comprises (B) 400 to 3,500 parts by mass of a thermally conductive filler.

    Room temperature curable organopolysiloxane composition for protecting electric/electronic parts
    2.
    发明授权
    Room temperature curable organopolysiloxane composition for protecting electric/electronic parts 有权

    公开(公告)号：US10851243B2

    公开(公告)日：2020-12-01

    申请号：US16326042

    申请日：2017-08-10

    申请人： Dow Corning Toray Co., Ltd.

    发明人： Harumi Kodama ,  Masayuki Onishi

    IPC分类号： C08L83/04 ,  C08K3/22 ,  C08K5/47 ,  C08K3/26 ,  C08G77/08 ,  C08K3/36 ,  C08K13/02

    摘要： A room temperature curable organopolysiloxane composition for protecting electric/electronic parts is disclosed. The composition comprises: (A) an organopolysiloxane having a viscosity at 25° C. of 20 to 1,000,000 mPa·s and having at least two silicon atom-bonded hydroxyl groups or silicon atom-bonded alkoxy groups in a molecule; (B) an alkoxysilane represented by the following general formula or a partial hydrolysis condensation product thereof: R1aSi(OR2)(4-a) wherein R1 is a monovalent hydrocarbon group having a carbon number of 1 to 12, R2 is an alkyl group having a carbon number of 1 to 3, and subscript “a” is an integer of 0 to 2; (C) a mercaptobenzothiazole based compound; (D) zinc oxide powder and/or zinc carbonate powder; and (E) a catalyst for condensation reactions. The composition and/or a cured product thereof can protect electric/electronic parts from corrosive gases such as hydrogen sulfide gas and sulfuric acid contained in the atmosphere.

    Method Of Protecting Transparent Nonmetallic Electroconductive Parts
    8.
    发明申请
    Method Of Protecting Transparent Nonmetallic Electroconductive Parts 审中-公开
    保护透明非金属导电部件的方法

    公开(公告)号：US20140227435A1

    公开(公告)日：2014-08-14

    申请号：US14117503

    申请日：2012-05-11

    申请人： Dow Corning Toray Co., Ltd.

    发明人： Katsuya Baba ,  Masayuki Onishi

    IPC分类号： H01B13/22

    CPC分类号： H01B13/228 ,  C08G77/16 ,  C08G77/18 ,  C08K5/3472 ,  C08K2201/001 ,  C08L83/04 ,  C09D183/04

    摘要： A method of protecting a transparent nonmetallic electroconductive part formed by, e.g., ITO, on a transparent substrate, e.g., a glass substrate, from electrochemical corrosion, is characterized by coating the transparent nonmetallic electroconductive part with a room-temperature-curable silicone rubber composition that contains from 1 weight-ppm to 30 weight % of a triazole compound, e.g., a 1,2,4-triazole compound or a benzotriazole compound; and thereafter curing the composition.

    摘要翻译： 通过例如ITO形成的透明非金属导电部件在透明基板（例如玻璃基板）上的电化学腐蚀的保护方法的特征在于用室温可固化硅橡胶组合物涂覆透明非金属导电部分 其含有1重量ppm至30重量％的三唑化合物，例如1,2,4-三唑化合物或苯并三唑化合物; 然后固化该组合物。