- 专利标题： Light emitting device having wire including stack structure
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申请号： US14499421申请日： 2014-09-29
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公开(公告)号： US10069053B2公开(公告)日： 2018-09-04
- 发明人: Shinya Okura , Shintaro Nakashima , Hiroki Fukuta
- 申请人： NICHIA CORPORATION
- 申请人地址： JP Anan-shi
- 专利权人： NICHIA CORPORATION
- 当前专利权人： NICHIA CORPORATION
- 当前专利权人地址： JP Anan-shi
- 优先权： JP2013-203440 20130930
- 主分类号： H01L29/18
- IPC分类号： H01L29/18 ; H01L33/62 ; H01L33/58 ; H01L33/50
摘要：
A light emitting device of the invention includes a substrate; a light emitting element mounted on the upper surface of the substrate; a wire that is electrically connected to the light emitting element; and a plate-shaped light-transmissive member that covers the light emitting element. The wire has a stack structure in which a first bonding ball, a bonding wire, and a second bonding ball are stacked in that order, the stack structure is disposed on the upper surface of the light emitting element, and the plate-shaped light-transmissive member is disposed above the stack structure.
公开/授权文献
- US20150091027A1 LIGHT EMITTING DEVICE 公开/授权日：2015-04-02
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