公开(公告)号：US10069053B2

公开(公告)日：2018-09-04

申请号：US14499421

申请日：2014-09-29

Applicant: NICHIA CORPORATION

Inventor： Shinya Okura ,  Shintaro Nakashima ,  Hiroki Fukuta

IPC: H01L29/18 ,  H01L33/62 ,  H01L33/58 ,  H01L33/50

Abstract: A light emitting device of the invention includes a substrate; a light emitting element mounted on the upper surface of the substrate; a wire that is electrically connected to the light emitting element; and a plate-shaped light-transmissive member that covers the light emitting element. The wire has a stack structure in which a first bonding ball, a bonding wire, and a second bonding ball are stacked in that order, the stack structure is disposed on the upper surface of the light emitting element, and the plate-shaped light-transmissive member is disposed above the stack structure.