Light emitting element and light emitting device

    公开(公告)号:US11024770B2

    公开(公告)日:2021-06-01

    申请号:US16123274

    申请日:2018-09-06

    摘要: A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, and first and second external connection parts. The first semiconductor layer is exposed from the light emitting layer and the second semiconductor layer at exposed portions arranged in columns each extending in a first direction. The insulating film defines openings respectively located above the exposed portions. The first electrode is connected to the first semiconductor layer through the openings and covers a part of the second semiconductor layer via the insulating film. The first external connection part is connected to the first electrode and spaced apart from the exposed portions in the plan view. The first external connection part has a shape elongated in the first direction between adjacent ones of the columns of the exposed portions. The second external connection part is connected to the second semiconductor layer via the second electrode.

    Method of manufacturing light emitting device

    公开(公告)号:US10461065B2

    公开(公告)日:2019-10-29

    申请号:US15364267

    申请日:2016-11-30

    摘要: A method of manufacturing a light emitting device includes: mounting light emitting elements on a collective substrate; arranging a first protruding member surrounding the light emitting elements; arranging a second protruding member between the light emitting elements; forming a cover member covering an upper end of the second protruding member, a lateral surface of each of the light emitting elements in a region surrounded by the first protruding member; and singulating the light emitting devices by cutting the cover member, the second protruding member, and the collective substrate at a portion including the second protruding member. The second protruding member is harder than the cover member. An upper end of the second protruding member is located lower than that of the first protruding member but higher than the upper surface of each of the light emitting elements.

    Light emitting device having wire including stack structure

    公开(公告)号:US10069053B2

    公开(公告)日:2018-09-04

    申请号:US14499421

    申请日:2014-09-29

    摘要: A light emitting device of the invention includes a substrate; a light emitting element mounted on the upper surface of the substrate; a wire that is electrically connected to the light emitting element; and a plate-shaped light-transmissive member that covers the light emitting element. The wire has a stack structure in which a first bonding ball, a bonding wire, and a second bonding ball are stacked in that order, the stack structure is disposed on the upper surface of the light emitting element, and the plate-shaped light-transmissive member is disposed above the stack structure.

    Light emitting device
    7.
    发明授权

    公开(公告)号:US11767967B2

    公开(公告)日:2023-09-26

    申请号:US18068175

    申请日:2022-12-19

    IPC分类号: F21V9/30 F21V7/04

    CPC分类号: F21V9/30 F21V7/04

    摘要: A light emitting device includes: a light emitting element configured to emit first light; a first wavelength conversion member disposed on the light emitting element and having a lower surface bonded to the light emitting element, an upper surface, and a lateral surface that meets the upper surface, the first wavelength conversion member being configured to emit second light when excited by the first light; a second wavelength conversion member covering the lateral surface of the first wavelength conversion member without covering the upper surface of the first wavelength conversion member, the second wavelength conversion member having an oblique surface extending outward from the lateral surface of the first wavelength conversion member, the second wavelength conversion member being configured to emit third light when excited by at least one of the first light and the second light; and a first light reflecting member covering the oblique surface.

    Light emitting device
    8.
    发明授权

    公开(公告)号:US11002427B2

    公开(公告)日:2021-05-11

    申请号:US16831191

    申请日:2020-03-26

    IPC分类号: F21V9/30 H01L33/50 F21Y115/10

    摘要: A light emitting device has a covering member. The covering member includes light reflecting material and a second fluorescent material, and a dominant wavelength of an emission spectrum of the second fluorescent material differs from a dominant wavelength of an emission spectrum of the light emitting device by 30 nm or less. The light emitting device emits light with chromaticity that is within a four-sided region on a CIE 1931 chromaticity diagram, where chromaticity coordinates (x, y) are (0.645, 0.335) at a first point, (0.665, 0.335) at a second point, (0.735, 0.265) at a third point, (0.721, 0.259) at a fourth point, and a first line joins the first and second points, a second line joins the second and third points, a third line joins the third and fourth points, and a fourth line joins the fourth and first points to define the four-sided region of the chromaticity diagram.

    Light emitting device
    9.
    发明授权

    公开(公告)号:US12078343B2

    公开(公告)日:2024-09-03

    申请号:US18451215

    申请日:2023-08-17

    IPC分类号: F21V9/30 F21V7/04

    CPC分类号: F21V9/30 F21V7/04

    摘要: A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a first wavelength conversion member disposed on the light emitting element and having a lower surface bonded to the light emitting element, an upper surface opposite the lower surface, and a lateral surface that meets the upper surface; a first light reflecting member disposed on an upper surface of the substrate and covering lateral surfaces of the light emitting element; and a second wavelength conversion member disposed on the first light reflecting member, on the upper surface of the substrate, and on the lateral surface of the first wavelength conversion member without covering the upper surface of the first wavelength conversion member.