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公开(公告)号:US11024770B2
公开(公告)日:2021-06-01
申请号:US16123274
申请日:2018-09-06
申请人: NICHIA CORPORATION
IPC分类号: H01L33/38 , H01L23/532 , H01L33/10 , H01L33/62 , H01L33/40 , H01L33/32 , H01L33/50 , H01L33/54 , H01L33/44
摘要: A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, and first and second external connection parts. The first semiconductor layer is exposed from the light emitting layer and the second semiconductor layer at exposed portions arranged in columns each extending in a first direction. The insulating film defines openings respectively located above the exposed portions. The first electrode is connected to the first semiconductor layer through the openings and covers a part of the second semiconductor layer via the insulating film. The first external connection part is connected to the first electrode and spaced apart from the exposed portions in the plan view. The first external connection part has a shape elongated in the first direction between adjacent ones of the columns of the exposed portions. The second external connection part is connected to the second semiconductor layer via the second electrode.
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公开(公告)号:US12080695B2
公开(公告)日:2024-09-03
申请号:US18463290
申请日:2023-09-08
申请人: NICHIA CORPORATION
发明人: Kenji Ozeki , Hiroki Fukuta
IPC分类号: H01L25/16 , H01L23/00 , H01L23/24 , H01L25/07 , H01L25/075 , H01L27/02 , H01L29/866 , H01L33/00 , H01L33/50 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62
CPC分类号: H01L25/167 , H01L24/26 , H01L24/73 , H01L24/96 , H01L24/97 , H01L33/0095 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L23/24 , H01L25/072 , H01L25/0753 , H01L27/0248 , H01L29/866 , H01L33/505 , H01L33/62 , H01L2224/16227 , H01L2224/26155 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/92225 , H01L2224/97 , H01L2924/12035 , H01L2924/12041 , H01L2924/1304 , H01L2924/1426 , H01L2924/1811 , H01L2924/19105 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0091 , H01L2224/97 , H01L2224/81 , H01L2224/97 , H01L2224/83
摘要: A method that includes providing a substrate having first and second regions for forming first and second light emitting devices, respectively, that are axisymmetrical in plan view with respect to a boundary line extending between the regions. The method includes mounting first and second light emitting elements in the first and second regions, respectively, arranging first and second light transmissive members respectively thereon, and arranging a covering member to collectively cover at least a portion of the first and second light emitting devices. The first and second devices have external connection terminals that are exposed. The terminals of the first light emitting device are on a side of the first light emitting device opposite to a side thereof adjacent the boundary line, and the terminals of the second light emitting device are on a side thereof opposite to a side of the second light emitting device adjacent the boundary line.
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公开(公告)号:US10825803B2
公开(公告)日:2020-11-03
申请号:US16558163
申请日:2019-09-02
申请人: NICHIA CORPORATION
发明人: Kenji Ozeki , Hiroki Fukuta
IPC分类号: H01L25/16 , H01L33/56 , H01L33/52 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/00 , H01L23/00 , H01L33/50 , H01L23/24 , H01L25/07 , H01L25/075 , H01L27/02 , H01L29/866 , H01L33/62
摘要: A light emitting device includes a substrate, light emitting elements, light transmissive members, an underfill, and a cover member. The light emitting elements are mounted on the substrate. The light transmissive members are each disposed on an upper surface of each of the light emitting elements. The underfill covers an upper surface of the substrate, lateral surfaces of the light emitting elements, and lateral surfaces of the light transmissive members between the light transmissive members. The cover member covers an upper surface of the underfill and has a hardness greater than a hardness of the underfill.
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公开(公告)号:US10461065B2
公开(公告)日:2019-10-29
申请号:US15364267
申请日:2016-11-30
申请人: NICHIA CORPORATION
发明人: Kenji Ozeki , Hiroki Fukuta
IPC分类号: H01L25/16 , H01L23/00 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/00 , H01L33/56 , H01L23/24 , H01L25/07 , H01L25/075 , H01L27/02 , H01L29/866 , H01L33/62 , H01L33/50
摘要: A method of manufacturing a light emitting device includes: mounting light emitting elements on a collective substrate; arranging a first protruding member surrounding the light emitting elements; arranging a second protruding member between the light emitting elements; forming a cover member covering an upper end of the second protruding member, a lateral surface of each of the light emitting elements in a region surrounded by the first protruding member; and singulating the light emitting devices by cutting the cover member, the second protruding member, and the collective substrate at a portion including the second protruding member. The second protruding member is harder than the cover member. An upper end of the second protruding member is located lower than that of the first protruding member but higher than the upper surface of each of the light emitting elements.
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公开(公告)号:US11791324B2
公开(公告)日:2023-10-17
申请号:US17837028
申请日:2022-06-10
申请人: NICHIA CORPORATION
发明人: Kenji Ozeki , Hiroki Fukuta
IPC分类号: H01L25/16 , H01L33/00 , H01L33/56 , H01L33/52 , H01L23/00 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/50 , H01L23/24 , H01L25/07 , H01L25/075 , H01L27/02 , H01L29/866 , H01L33/62
CPC分类号: H01L25/167 , H01L24/26 , H01L24/73 , H01L24/96 , H01L24/97 , H01L33/0095 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L23/24 , H01L25/072 , H01L25/0753 , H01L27/0248 , H01L29/866 , H01L33/505 , H01L33/62 , H01L2224/16227 , H01L2224/26155 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/92225 , H01L2224/97 , H01L2924/12035 , H01L2924/12041 , H01L2924/1304 , H01L2924/1426 , H01L2924/1811 , H01L2924/19105 , H01L2933/005 , H01L2933/0033 , H01L2933/0041 , H01L2933/0091 , H01L2224/97 , H01L2224/81 , H01L2224/97 , H01L2224/83
摘要: A light emitting device includes a substrate, a light emitting element, and a protective element. The substrate includes a support member and a plurality of wirings disposed on an upper surface of the support member. The substrate has a first side extending in a first direction and a second side opposite to the first side. The light emitting element is disposed on an upper surface of the substrate, and the protective element is disposed on the upper surface of the substrate. The plurality of wirings has a plurality of external connecting portions disposed adjacent to the first side and arranged in the first direction in a plan view. The protective element is disposed between the light emitting element and the second side of the substrate.
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公开(公告)号:US10069053B2
公开(公告)日:2018-09-04
申请号:US14499421
申请日:2014-09-29
申请人: NICHIA CORPORATION
发明人: Shinya Okura , Shintaro Nakashima , Hiroki Fukuta
摘要: A light emitting device of the invention includes a substrate; a light emitting element mounted on the upper surface of the substrate; a wire that is electrically connected to the light emitting element; and a plate-shaped light-transmissive member that covers the light emitting element. The wire has a stack structure in which a first bonding ball, a bonding wire, and a second bonding ball are stacked in that order, the stack structure is disposed on the upper surface of the light emitting element, and the plate-shaped light-transmissive member is disposed above the stack structure.
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公开(公告)号:US11767967B2
公开(公告)日:2023-09-26
申请号:US18068175
申请日:2022-12-19
申请人: NICHIA CORPORATION
发明人: Yusuke Hayashi , Satoshi Shichijo , Hiroki Fukuta
摘要: A light emitting device includes: a light emitting element configured to emit first light; a first wavelength conversion member disposed on the light emitting element and having a lower surface bonded to the light emitting element, an upper surface, and a lateral surface that meets the upper surface, the first wavelength conversion member being configured to emit second light when excited by the first light; a second wavelength conversion member covering the lateral surface of the first wavelength conversion member without covering the upper surface of the first wavelength conversion member, the second wavelength conversion member having an oblique surface extending outward from the lateral surface of the first wavelength conversion member, the second wavelength conversion member being configured to emit third light when excited by at least one of the first light and the second light; and a first light reflecting member covering the oblique surface.
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公开(公告)号:US11002427B2
公开(公告)日:2021-05-11
申请号:US16831191
申请日:2020-03-26
申请人: NICHIA CORPORATION
发明人: Makiko Iwasa , Yuji Sato , Hiroki Fukuta
IPC分类号: F21V9/30 , H01L33/50 , F21Y115/10
摘要: A light emitting device has a covering member. The covering member includes light reflecting material and a second fluorescent material, and a dominant wavelength of an emission spectrum of the second fluorescent material differs from a dominant wavelength of an emission spectrum of the light emitting device by 30 nm or less. The light emitting device emits light with chromaticity that is within a four-sided region on a CIE 1931 chromaticity diagram, where chromaticity coordinates (x, y) are (0.645, 0.335) at a first point, (0.665, 0.335) at a second point, (0.735, 0.265) at a third point, (0.721, 0.259) at a fourth point, and a first line joins the first and second points, a second line joins the second and third points, a third line joins the third and fourth points, and a fourth line joins the fourth and first points to define the four-sided region of the chromaticity diagram.
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公开(公告)号:US12078343B2
公开(公告)日:2024-09-03
申请号:US18451215
申请日:2023-08-17
申请人: NICHIA CORPORATION
发明人: Yusuke Hayashi , Satoshi Shichijo , Hiroki Fukuta
摘要: A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a first wavelength conversion member disposed on the light emitting element and having a lower surface bonded to the light emitting element, an upper surface opposite the lower surface, and a lateral surface that meets the upper surface; a first light reflecting member disposed on an upper surface of the substrate and covering lateral surfaces of the light emitting element; and a second wavelength conversion member disposed on the first light reflecting member, on the upper surface of the substrate, and on the lateral surface of the first wavelength conversion member without covering the upper surface of the first wavelength conversion member.
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10.
公开(公告)号:US11417811B2
公开(公告)日:2022-08-16
申请号:US16717305
申请日:2019-12-17
申请人: NICHIA CORPORATION
IPC分类号: H01L33/62 , H01L33/32 , H01L33/44 , H01L33/38 , H01L33/60 , H01L33/00 , H01L33/56 , H01L33/40 , H01L33/64 , H01L27/15 , H01L33/20 , H01L25/075
摘要: A light emitting element includes a semiconductor stacked body, an insulating film, first and second electrodes, a second external connection portion, and first external connection portions. The first semiconductor layer is exposed at a plurality of exposed portions disposed in a plurality of rows in plan view. The first external connection portions include at least one smaller-size first external connection portion disposed between adjacent ones of the rows other than the outermost one of the rows, and at least one larger-size first external connection portion extending from the end region, in which a spacing between a first outer edge of a second semiconductor layer and the exposed portions in the outermost one of the rows is narrower than a spacing between the exposed portions in adjacent ones of the rows, to at least a position between the outermost one of the rows and an adjacent one of the rows.
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