Invention Grant
- Patent Title: Encapsulation of acoustic resonator devices
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Application No.: US15137662Application Date: 2016-04-25
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Publication No.: US10069474B2Publication Date: 2018-09-04
- Inventor: Changhan Hobie Yun , Chengjie Zuo , Daeik Daniel Kim , Mario Francisco Velez , Niranjan Sunil Mudakatte , Je-Hsiung Jeffrey Lan , David Francis Berdy , Yunfei Ma , Robert Paul Mikulka , Jonghae Kim
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated-Toler
- Main IPC: H03H9/05
- IPC: H03H9/05 ; H03H9/10 ; H03H9/15 ; H03H3/02 ; H01F17/02 ; H05K1/18 ; H03H9/54 ; H05K3/46 ; H05K1/03 ; H05K3/00 ; H03H3/08 ; H03H9/64 ; H01F17/00 ; H03H7/01 ; H03H7/46
Abstract:
A device includes an acoustic resonator embedded within an encapsulating structure that at least partially encapsulates the acoustic resonator. The device includes an inductor electrically connected to the acoustic resonator. At least a portion of the inductor is embedded in the encapsulating structure.
Public/Granted literature
- US20170141756A1 ACOUSTIC RESONATOR DEVICES Public/Granted day:2017-05-18
Information query
