- 专利标题： Encapsulation of acoustic resonator devices
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申请号： US15137662申请日： 2016-04-25
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公开(公告)号： US10069474B2公开(公告)日： 2018-09-04
- 发明人: Changhan Hobie Yun , Chengjie Zuo , Daeik Daniel Kim , Mario Francisco Velez , Niranjan Sunil Mudakatte , Je-Hsiung Jeffrey Lan , David Francis Berdy , Yunfei Ma , Robert Paul Mikulka , Jonghae Kim
- 申请人： QUALCOMM Incorporated
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM Incorporated
- 当前专利权人： QUALCOMM Incorporated
- 当前专利权人地址： US CA San Diego
- 代理机构： Qualcomm Incorporated-Toler
- 主分类号： H03H9/05
- IPC分类号： H03H9/05 ; H03H9/10 ; H03H9/15 ; H03H3/02 ; H01F17/02 ; H05K1/18 ; H03H9/54 ; H05K3/46 ; H05K1/03 ; H05K3/00 ; H03H3/08 ; H03H9/64 ; H01F17/00 ; H03H7/01 ; H03H7/46
摘要：
A device includes an acoustic resonator embedded within an encapsulating structure that at least partially encapsulates the acoustic resonator. The device includes an inductor electrically connected to the acoustic resonator. At least a portion of the inductor is embedded in the encapsulating structure.
公开/授权文献
- US20170141756A1 ACOUSTIC RESONATOR DEVICES 公开/授权日：2017-05-18
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