Invention Grant
- Patent Title: Processing liquid supplying apparatus and processing liquid supplying method
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Application No.: US14485914Application Date: 2014-09-15
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Publication No.: US10074546B2Publication Date: 2018-09-11
- Inventor: Yuichi Terashita , Kousuke Yoshihara , Koji Takayanagi , Toshinobu Furusho , Takashi Sasa
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2013-207748 20131002
- Main IPC: B01D19/00
- IPC: B01D19/00 ; H01L21/67

Abstract:
Disclosed is a processing liquid supplying apparatus. The apparatus includes: a processing liquid supply source configured to supply a processing liquid for processing a substrate to be processed; an ejection unit configured to eject the processing liquid to the substrate to be processed; a filter device configured to remove foreign matters in the processing liquid; a supply pump and an ejection pump which are provided in the supply path at a primary side and a secondary side of the filter device, respectively; and a control unit configured to output a control signal to decompress and degas the processing liquid supplied from the processing liquid supply source by using one of the supply pump and the ejection pump, and subsequently, pass the degassed processing liquid through the filter device beginning from the primary side to the secondary side of the filter device by using the supply pump and the ejection pump.
Public/Granted literature
- US20150092167A1 PROCESSING LIQUID SUPPLYING APPARATUS AND PROCESSING LIQUID SUPPLYING METHOD Public/Granted day:2015-04-02
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