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公开(公告)号：US09899243B2
公开(公告)日：2018-02-20
申请号：US14962133
申请日：2015-12-08
Applicant: Tokyo Electron Limited
Inventor： Masahide Tadokoro , Yuichi Terashita , Gousuke Shiraishi , Tomohiro Iseki , Masaru Tomono , Hironori Mizoguchi
CPC classification number: H01L21/67115 , G03F7/70991
Abstract: A light irradiation apparatus includes: a rotary holding unit that rotates a substrate around a rotary axis while holding the substrate; a lighting unit positioned to face the rotary holding unit; a light shielding mask positioned between the rotary holding unit and the lighting unit, and widened along a direction orthogonal to the rotary axis; and a driving unit that linearly moves the lighting unit along the direction orthogonal to the rotary axis. The light shielding mask overlaps with the substrate when viewed in the direction of the rotary axis. The light shielding mask has an opening portion. An opening width of the opening portion at a side away from the rotary axis is larger than the opening with near the rotary axis. The lighting unit irradiates light through the opening portion toward the surface of the substrate while being moved above the opening portion by the driving unit.
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公开(公告)号：US09732910B2
公开(公告)日：2017-08-15
申请号：US14497930
申请日：2014-09-26
Applicant: TOKYO ELECTRON LIMITED
Inventor： Koji Takayanagi , Kousuke Yoshihara , Yuichi Terashita , Toshinobu Furusho , Takashi Sasa
IPC: F17D3/01
CPC classification number: F17D3/01 , F17C1/00 , Y10T137/0318 , Y10T137/794
Abstract: A processing-liquid supply apparatus includes a source, a discharge device, a supply channel connecting the source and discharge device, a filter device positioned in the channel to form first side having the source and second side having the discharge device, a pump device positioned in the channel, and a control device which controls suction and discharge by the pump device. The control device controls the pump device such that the liquid is discharged from the discharge device, that remaining of the liquid on the second side is suctioned to be returned to the first side and that the remaining of the liquid returned to the first side flows from the first toward second side together with refill of the liquid from the source, and the control device is set such that return amount of the liquid to the filter device is equal to or greater than amount of the discharge.
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3.发明申请PROCESSING LIQUID SUPPLYING APPARATUS AND PROCESSING LIQUID SUPPLYING METHOD 审中-公开处理液体供应设备和处理液体供应方法公开(公告)号：US20150092167A1
公开(公告)日：2015-04-02
申请号：US14485914
申请日：2014-09-15
Applicant: Tokyo Electron Limited
Inventor： Yuichi Terashita , Kousuke Yoshihara , Koji Takayanagi , Toshinobu Furusho , Takashi Sasa
IPC: G03F7/20
CPC classification number: H01L21/67017
Abstract: Disclosed is a processing liquid supplying apparatus. The apparatus includes: a processing liquid supply source configured to supply a processing liquid for processing a substrate to be processed; an ejection unit configured to eject the processing liquid to the substrate to be processed; a filter device configured to remove foreign matters in the processing liquid; a supply pump and an ejection pump which are provided in the supply path at a primary side and a secondary side of the filter device, respectively; and a control unit configured to output a control signal to decompress and degas the processing liquid supplied from the processing liquid supply source by using one of the supply pump and the ejection pump, and subsequently, pass the degassed processing liquid through the filter device beginning from the primary side to the secondary side of the filter device by using the supply pump and the ejection pump.
Abstract translation: 公开了一种处理液供给装置。 该装置包括：处理液供给源，被配置为提供用于处理待处理基板的处理液; 喷射单元，被配置为将处理液喷射到待处理的基板; 被配置为去除处理液中的异物的过滤装置; 供给泵和喷射泵，其分别设置在所述供给路径中的所述过滤装置的初级侧和次级侧; 以及控制单元，其被配置为输出控制信号，以通过使用所述供给泵和所述喷射泵中的一个来对从所述处理液体供给源供给的处理液进行解压缩和脱气，并且随后将所述脱气处理液通过所述过滤装置，从 通过使用供应泵和排出泵将过滤装置的次级侧的初级侧。
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公开(公告)号：US10901320B2
公开(公告)日：2021-01-26
申请号：US16124328
申请日：2018-09-07
Applicant: TOKYO ELECTRON LIMITED
Inventor： Tomohiro Iseki , Hirofumi Takeguchi , Yuichi Terashita
Abstract: There is provided a method of developing an exposed resist film formed on a surface of a substrate to form a resist pattern, which includes: rotating the substrate about a rotation axis that extends in a direction perpendicular to the surface of the substrate that is horizontally supported; supplying a developing solution through a discharge hole positioned above the substrate onto the resist film such that the developing solution is widely spread on a surface of the resist film; and positioning a wetted part having a surface that faces the surface of the substrate, above a preceding region in the surface of the substrate, the preceding region being a region to which the developing solution is preferentially supplied through the discharge hole.
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公开(公告)号：US10022652B2
公开(公告)日：2018-07-17
申请号：US15818855
申请日：2017-11-21
Applicant: Tokyo Electron Limited
Inventor： Kousuke Yoshihara , Katsunori Ichino , Toshinobu Furusho , Takashi Sasa , Katsuhiro Tsuchiya , Yuichi Terashita , Hirofumi Takeguchi
Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.
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Patent Agency Ranking
公开(公告)号：US20140235070A1
公开(公告)日：2014-08-21
申请号：US13770771
申请日：2013-02-19
Applicant: TOKYO ELECTRON LIMITED
Inventor： Derek W. Bassett , Wallace P. Printz , Joshua S. Hooge , Katsunori Ichino , Yuichi Terashita , Kousuke Yoshihara
CPC classification number: H01L21/6715 , B05C11/08 , G03F7/162 , H01L21/67034
Abstract: Techniques disclosed herein provide an apparatus and method of spin coating that inhibits the formation of wind marks and other defects from turbulent fluid-flow, thereby enabling higher rotational velocities and decreased drying times, while maintaining film uniformity. Techniques disclosed herein include a fluid-flow member, such as a ring or cover, positioned or suspended above the surface of a wafer or other substrate. The fluid-flow member has a radial curvature that prevents wind marks during rotation of a wafer during a coating and spin drying process.
Abstract translation: 本文公开的技术提供了一种旋转涂覆的装置和方法，其抑制风标记和其他缺陷从湍流流体流动的形成，从而在保持膜均匀性的同时实现更高的旋转速度和降低的干燥时间。 本文公开的技术包括定位或悬浮在晶片或其他基底的表面上方的流体流动构件，例如环或盖。 流体流动构件具有在涂覆和旋转干燥过程期间在晶片旋转期间防止风标的径向曲率。
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公开(公告)号：US20200227286A1
公开(公告)日：2020-07-16
申请号：US16052875
申请日：2018-08-02
Applicant: Tokyo Electron Limited
Inventor： Yuichi Terashita , Kousuke Yoshihara , Koji Takayanagi , Toshinobu Furusho , Takashi Sasa
IPC: H01L21/67
Abstract: Disclosed is a processing liquid supplying apparatus. The apparatus includes: a processing liquid supply source configured to supply a processing liquid for processing a substrate to be processed; an ejection unit configured to eject the processing liquid to the substrate to be processed; a filter device configured to remove foreign matters in the processing liquid; a supply pump and an ejection pump which are provided in the supply path at a primary side and a secondary side of the filter device, respectively; and a control unit configured to output a control signal to decompress and degas the processing liquid supplied from the processing liquid supply source by using one of the supply pump and the ejection pump, and subsequently, pass the degassed processing liquid through the filter device beginning from the primary side to the secondary side of the filter device by using the supply pump and the ejection pump.
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公开(公告)号：US09972512B2
公开(公告)日：2018-05-15
申请号：US15716663
申请日：2017-09-27
Applicant: TOKYO ELECTRON LIMITED
Inventor： Akiko Kai , Takafumi Niwa , Shogo Takahashi , Hiroshi Nishihata , Yuichi Terashita , Teruhiko Kodama
IPC: H01L21/67 , H01L21/311 , H01L21/687 , G03F7/30 , H01L21/033 , H01L21/02
CPC classification number: H01L21/67051 , G03F7/3021 , H01L21/0206 , H01L21/0337 , H01L21/31133 , H01L21/31144 , H01L21/6708 , H01L21/68742
Abstract: A liquid processing apparatus for liquid-processing a substrate includes a substrate holding device that rotates a substrate in horizontal position, a nozzle holding device holding processing liquid and gas nozzles, the liquid nozzle discharging processing liquid from a discharge port such that the liquid is discharged obliquely to surface of the substrate, the gas nozzle discharging gas perpendicularly to the surface of the substrate, a moving device that moves the nozzle device with respect to the surface of the substrate, and a control device including circuitry that controls the nozzle, substrate and moving devices such that while the substrate is rotated, the liquid is discharged to peripheral portion toward downstream side in rotation direction and along tangential direction of the substrate and gas is discharged from the gas nozzle toward position adjacent to liquid landing position of the liquid on the surface and is on center side of the substrate.
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公开(公告)号：US20180093205A1
公开(公告)日：2018-04-05
申请号：US15818855
申请日：2017-11-21
Applicant: Tokyo Electron Limited
Inventor： Kousuke Yoshihara , Katsunori Ichino , Toshinobu Furusho , Takashi Sasa , Katsuhiro Tsuchiya , Yuichi Terashita , Hirofumi Takeguchi
CPC classification number: B01D19/0063 , B01D19/0031 , B01D19/0068 , G03F7/16 , G03F7/30 , H01L21/6715
Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.
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10.发明申请公开(公告)号：US20160096203A1
公开(公告)日：2016-04-07
申请号：US14870609
申请日：2015-09-30
Applicant: TOKYO ELECTRON LIMITED
Inventor： Akiko Kai , Takafumi Niwa , Shogo Takahashi , Hiroshi Nishihata , Yuichi Terashita , Teruhiko Kodama
IPC: B08B3/10
CPC classification number: H01L21/67051 , G03F7/3021 , H01L21/0206 , H01L21/0337 , H01L21/31133 , H01L21/31144 , H01L21/6708 , H01L21/68742
Abstract: A liquid processing method for liquid-processing a substrate includes setting a substrate on a substrate holding device which rotates the substrate such that the substrate is held in horizontal position, supplying processing liquid to center portion of the substrate such that the center portion positioned center side with respect to peripheral portion of the substrate is liquid-processed, positioning a discharge port of a processing liquid nozzle toward downstream side in rotation direction such that the liquid is discharged to the peripheral portion obliquely to surface of the substrate and along tangential direction of the substrate while the substrate is rotated, and discharging gas from a gas nozzle perpendicularly to the surface of the substrate toward position that is adjacent to liquid landing position of the liquid on the surface of the substrate and is on the center side of the substrate, while the liquid is discharged to the peripheral portion.
Abstract translation: 一种用于液体处理衬底的液体处理方法包括：在基板保持装置上设置基板，该基板保持装置旋转基板，使得基板保持在水平位置，将处理液体供应到基板的中心部分，使得位于中心部分的中心部分 相对于基板的周边部分进行液体处理，将处理液喷嘴的排出口朝向旋转方向的下游侧定位，使得液体倾斜地向基板的周边部分排出并且沿着切割方向 衬底，同时衬底旋转，并且将气体从气体喷嘴垂直于衬底的表面朝着与衬底表面上的液体着陆位置相邻的位置，并位于衬底的中心侧，同时 液体被排出到周边部分。
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