Invention Grant
- Patent Title: Arc ablation-resistant tungsten alloy switch contact and preparation method thereof
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Application No.: US15318144Application Date: 2015-07-15
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Publication No.: US10079119B2Publication Date: 2018-09-18
- Inventor: Huisheng Han , Zhenxing Wang , Yang Ding , Hongmei Zhang
- Applicant: NANTONG MEMTECH TECHNOLOGIES CO., LTD.
- Applicant Address: CN Nantong, Jiangsu
- Assignee: NANTONG MEMTECH TECHNOLOGIES CO., LTD.
- Current Assignee: NANTONG MEMTECH TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Nantong, Jiangsu
- Agency: Rankin, Hill & Clark LLP
- Priority: CN201410349019 20140721
- International Application: PCT/CN2015/084164 WO 20150715
- International Announcement: WO2016/011908 WO 20160128
- Main IPC: H01H1/021
- IPC: H01H1/021 ; H01H11/04 ; H01H11/06 ; C23C18/48 ; C25D3/12 ; C25D3/56 ; C23C18/16 ; C23C18/18 ; C23C18/32 ; C23C18/50 ; C23C18/52 ; C25D7/06 ; C25D7/00

Abstract:
An arc-ablation resistant tungsten alloy switch contact and preparation method is disclosed. A contact member has a three-layer structure, wherein a first layer is a hydrophobic rubber layer, a second layer is a sheet metal layer, and a third layer is a tungsten alloy chemical deposition layer. A plating bath adopted in the chemical deposition contains 25-125 g/L soluble tungsten compound, 0-60 g/L soluble compound of a transition metal like ferrum, nickel, cobalt, copper or manganese, and 0-30 g/L soluble compound of tin, stibium, lead or bismuth. When a layered complex of the hydrophobic rubber layer and the sheet metal layer is chemically plated by the plating bath, a tungsten alloy plated layer is selectively deposited on a metal surface, and chemical deposition of the tungsten alloy does not occur on a surface of the hydrophobic rubber fundamentally.
Public/Granted literature
- US20170125180A1 ARC-ABLATION RESISTANT TUNGSTEN ALLOY SWITCH CONTACT AND PREPARATION METHOD THEREOF Public/Granted day:2017-05-04
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