Invention Grant
- Patent Title: Semiconductor device having fin-type patterns
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Application No.: US15850183Application Date: 2017-12-21
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Publication No.: US10083965B2Publication Date: 2018-09-25
- Inventor: Ki Hwan Kim , Gi Gwan Park , Jung Gun You , Dong Suk Shin , Hyun Yul Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2015-0171393 20151203; KR10-2016-0010593 20160128
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L27/092 ; H01L21/84 ; H01L27/088 ; H01L27/12 ; H01L29/06 ; H01L29/08 ; H01L29/165 ; H01L29/167 ; H01L29/417 ; H01L29/45 ; H01L29/78 ; H01L27/02

Abstract:
The semiconductor device includes a substrate comprising first and second regions, in the first region, first and second gate electrodes formed parallel to each other on the substrate, and being spaced apart from each other by a first distance, in the second region, third and fourth gate electrodes formed parallel to each other on the substrate, and being spaced apart from each other by a second distance which is greater than the first distance, in the first region, a first recess formed on the substrate between the first and second gate electrodes, in the second region, a second recess formed on the substrate between the third and fourth gate electrodes, a first epitaxial source/drain filling the first recess and a second epitaxial source/drain filling the second recess, wherein an uppermost portion of an upper surface of the first epitaxial source/drain is higher than an uppermost portion of an upper surface of the second epitaxial source/drain.
Public/Granted literature
- US20180114791A1 SEMICONDUCTOR DEVICE HAVING FIN-TYPE PATTERNS Public/Granted day:2018-04-26
Information query
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