发明授权
- 专利标题： Power amplifier modules with bonding pads and related systems, devices, and methods
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申请号： US15482321申请日： 2017-04-07
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公开(公告)号： US10090812B2公开(公告)日： 2018-10-02
- 发明人: Hardik Bhupendra Modi , Sandra Louise Petty-Weeks , Hongxiao Shao , Weimin Sun , Peter J. Zampardi, Jr. , Guohao Zhang
- 申请人： Skyworks Solutions, Inc.
- 申请人地址： US MA Woburn
- 专利权人： Skyworks Solutions, Inc.
- 当前专利权人： Skyworks Solutions, Inc.
- 当前专利权人地址： US MA Woburn
- 代理机构： Knobbe, Martens, Olson & Bear, LLP
- 主分类号： H03F3/14
- IPC分类号： H03F3/14 ; H03F3/213 ; H01L29/20 ; H01L23/498 ; H01L21/48 ; H01L29/08 ; H01L23/31 ; H01L21/8249 ; H01L21/78 ; H01L21/56 ; H01L21/66 ; H01L23/48 ; H01L21/768 ; H03F3/19 ; H03F3/24 ; H01L29/36 ; H01L29/66 ; H01L29/812 ; H01L29/205 ; H01L21/8252 ; H01L27/06 ; H01L23/552 ; H01L23/66 ; H01L23/00 ; H01L23/50 ; H03F3/195 ; H03F3/60 ; H03F1/02 ; H03F3/21 ; H03F3/45 ; H01L29/737 ; H01L29/06 ; H01L29/10 ; H01L29/8605 ; H01L27/092 ; H03F3/187 ; H03F3/347
摘要：
One aspect of this disclosure is a power amplifier module that includes a power amplifier die, a first bonding pad on a conductive trace, and a second bonding pad on a conductive trace. The die includes an on-die passive device and a power amplifier. The first bonding pad is electrically connected to the on-die passive device by a first wire bond. The second bonding pad is in a conductive path between the first bonding pad and a radio frequency output of the power amplifier module. The second bonding pad includes a nickel layer having a thickness that is less than 0.5 um, a palladium layer over the nickel layer, and a gold layer over the palladium layer and bonded to a second wire bond that is electrically connected to an output of the power amplifier. Other embodiments of the module are provided along with related methods and components thereof.
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