Invention Grant
- Patent Title: Vertical device architecture
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Application No.: US15615195Application Date: 2017-06-06
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Publication No.: US10096706B2Publication Date: 2018-10-09
- Inventor: Chih-Hao Wang , Jhon Jhy Liaw , Wai-Yi Lien , Jia-Chuan You , Yi-Hsun Chiu , Ching-Wei Tsai , Wei-Hao Wu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L27/11582 ; H01L27/11556 ; H01L27/06 ; H01L29/788 ; H01L29/792 ; H01L27/1158 ; H01L27/11 ; H01L21/822

Abstract:
In some embodiments, the present disclosure relates to a vertical transistor device, and an associated method of formation. The transistor device has a source region over a substrate and a vertical channel bar over the source region. The vertical channel bar has a bottom surface with an elongated shape. A conductive gate region is separated from sidewalls of the vertical channel bar by a gate dielectric layer. The conductive gate region has a vertical leg and a horizontal leg protruding outward from a sidewall of the vertical leg. A dielectric layer vertically extends from a plane extending along an uppermost surface of the conductive gate region to a position surrounded by the conductive gate region. A drain contact is over the vertical channel bar.
Public/Granted literature
- US20170271510A1 VERTICAL DEVICE ARCHITECTURE Public/Granted day:2017-09-21
Information query
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