- 专利标题: Metallized particle interconnect with solder components
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申请号: US14462721申请日: 2014-08-19
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公开(公告)号: US10104772B2公开(公告)日: 2018-10-16
- 发明人: Layne A. Berge , John R. Dangler , Matthew S. Doyle , Jesse Hefner
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Incorporated
- 当前专利权人: International Business Machines Incorporated
- 当前专利权人地址: US NY Armonk
- 代理机构: Wood, Herron & Evans, LLP
- 代理商 Robert R. Williams
- 主分类号: B23K1/00
- IPC分类号: B23K1/00 ; H05K3/34 ; H05K1/14 ; H05K1/18 ; B23K1/008 ; B23K1/19 ; B23K3/047 ; B23K3/08 ; B23K101/42
摘要:
An electrical connection is established between a first electrical component and a second electrical component of an assembly and a compression tool is used to apply a compression force to the assembly. The assembly also includes a metallized particle interconnect (MPI) between the first electrical component and the second electrical component and solder components outside a boundary of the MPI and extending from the first electrical component to the second electrical component. The solder components are melted by applying heat to the assembly. The solder components are solidified by cooling the assembly and the compression tool is removed.
公开/授权文献
- US20160057860A1 METALLIZED PARTICLE INTERCONNECT WITH SOLDER COMPONENTS 公开/授权日:2016-02-25
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