- Patent Title: Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, mask blank provided with actinic ray-sensitive or radiation-sensitive film, photomask, pattern forming method, method for manufacturing electronic device, and electronic device
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Application No.: US15176345Application Date: 2016-06-08
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Publication No.: US10120281B2Publication Date: 2018-11-06
- Inventor: Koutarou Takahashi , Tomotaka Tsuchimura , Shuhei Yamaguchi , Natsumi Yokokawa , Hidehiro Mochizuki
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-020783 20140205
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G03F7/24 ; G03F7/038 ; G03F7/32 ; G03F1/24 ; G03F1/50 ; G03F1/78

Abstract:
An actinic ray-sensitive or radiation-sensitive resin composition includes an alkali-soluble resin (A) having a phenolic hydroxyl group, and a crosslinking agent (C) having two or more hydroxymethyl groups or alkoxymethyl groups in total within the molecule, wherein the composition contains a crosslinking agent (C1) having a molecular weight of 420 or more and also having two to four hydroxymethyl groups or alkoxymethyl groups in total within the molecule in a proportion of 60 mol % to 100 mol % based on the total amount of the crosslinking agent (C) including the crosslinking agent (C1), and in which the total concentration of the hydroxymethyl groups or the alkoxymethyl groups of the crosslinking agent (C) relative to 1 g of the solid content in the actinic ray-sensitive or radiation-sensitive resin composition is 0.30 mmol/g or more.
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