Invention Grant
- Patent Title: Via and trench filling using injection molded soldering
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Application No.: US15196558Application Date: 2016-06-29
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Publication No.: US10130302B2Publication Date: 2018-11-20
- Inventor: John U. Knickerbocker , Shriya Kumar , Jae-Woong Nah
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent L. Jeffrey Kelly
- Main IPC: H01L21/768
- IPC: H01L21/768 ; A61B5/00 ; H01L23/15 ; H01L23/498 ; H01L23/532 ; H01L21/48 ; H05K1/03 ; H01L23/00 ; A61M5/00 ; B23K3/06 ; H01L23/538 ; H01L23/66 ; H05K3/40 ; B23K101/36
Abstract:
A method includes forming one or more vias in a substrate, forming at least one liner on at least one sidewall of at least one of the vias, and filling said at least one via with solder material using injection molded soldering. The at least one liner may comprise a solder adhesion layer, a barrier layer, or a combination of a barrier layer and a solder adhesion layer.
Public/Granted literature
- US20180005879A1 VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING Public/Granted day:2018-01-04
Information query
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