公开(公告)号：US20200288991A1

公开(公告)日：2020-09-17

申请号：US16299311

申请日：2019-03-12

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： JOHN KNICKERBOCKER ,  Shriya Kumar

IPC分类号： A61B5/0205 ,  G16H20/30 ,  G16H10/65 ,  G16H40/63 ,  A61B5/145 ,  A61B5/00

摘要： A health & fitness tracking device may include a display that provides fitness information to a wearer of the health & fitness tracking device, at least one physiological sensor that obtains physiological data by monitoring at least one physiological condition of the wearer, at least one environmental sensor that obtains environmental data by monitoring at least one environmental condition, a data storage device that stores the physiological data, the environmental data, and medical history data relating to the wearer, a memory storing a computer program, and a processor that executes the computer program. The computer program may adjust a sensor configuration of the at least one physiological sensor based on the medical history data.

公开(公告)号：US09773751B1

公开(公告)日：2017-09-26

申请号：US15214935

申请日：2016-07-20

申请人： International Business Machines Corporation

发明人： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： A61B5/68 ,  A61B2562/12 ,  A61M5/00 ,  A61M2207/00 ,  B23K3/0638 ,  B23K2101/36 ,  H01L21/486 ,  H01L21/76816 ,  H01L21/76852 ,  H01L21/76883 ,  H01L21/76898 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/53228 ,  H01L23/53238 ,  H01L23/53242 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/64 ,  H01L24/69 ,  H01L24/83 ,  H01L24/89 ,  H01L2223/6677 ,  H01L2224/27312 ,  H01L2224/32111 ,  H01L2224/32235 ,  H01L2224/325 ,  H01L2224/64 ,  H01L2224/69 ,  H01L2224/83801 ,  H01L2224/89 ,  H01L2224/96 ,  H01L2924/014 ,  H01L2924/1434 ,  H01L2924/15332 ,  H05K1/0306 ,  H05K3/4038 ,  H05K2201/0305

摘要： A method includes forming one or more vias in a first layer, forming one or more vias in at least a second layer different than the first layer, aligning at least a first via in the first layer with at least a second via in the second layer, and bonding the first layer to the second layer by filling the first via and the second via with solder material using injection molded soldering.

公开(公告)号：US10383572B2

公开(公告)日：2019-08-20

申请号：US15610885

申请日：2017-06-01

申请人： International Business Machines Corporation

发明人： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC分类号： H05K3/40 ,  A61B5/00 ,  H01L21/768 ,  H01L23/498 ,  H01L23/532 ,  H01L21/48 ,  H05K1/03 ,  H01L23/00 ,  A61M5/00 ,  B23K3/06 ,  H01L23/66 ,  H01L23/13 ,  H01L23/15 ,  B23K101/36 ,  H01L23/538 ,  H01L23/14

摘要： A method includes forming one or more vias in a substrate, forming a first photoresist layer on a top surface of the substrate and a second photoresist layer on a bottom surface of the substrate, patterning the first photoresist layer and the second photoresist layer to remove at least a first portion of the first photoresist layer and at least a second portion of the second photoresist layer, filling the one or more vias, the first portion and the second portion with solder material using injection molded soldering, and removing remaining portions of the first photoresist layer and the second photoresist layer.

公开(公告)号：US10258279B2

公开(公告)日：2019-04-16

申请号：US15612190

申请日：2017-06-02

申请人： International Business Machines Corporation

发明人： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC分类号： H01L21/48 ,  A61B5/00 ,  H01L21/768 ,  H01L23/15 ,  H01L23/498 ,  H01L23/532 ,  H05K1/03 ,  H01L23/00 ,  A61M5/00 ,  B23K3/06 ,  H01L23/538 ,  H01L23/66 ,  H05K3/40 ,  B23K101/36

摘要： A method includes forming one or more vias in a first layer, forming one or more vias in at least a second layer different than the first layer, aligning at least a first via in the first layer with at least a second via in the second layer, and bonding the first layer to the second layer by filling the first via and the second via with solder material using injection molded soldering.

公开(公告)号：US10130302B2

公开(公告)日：2018-11-20

申请号：US15196558

申请日：2016-06-29

申请人： International Business Machines Corporation

发明人： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC分类号： H01L21/768 ,  A61B5/00 ,  H01L23/15 ,  H01L23/498 ,  H01L23/532 ,  H01L21/48 ,  H05K1/03 ,  H01L23/00 ,  A61M5/00 ,  B23K3/06 ,  H01L23/538 ,  H01L23/66 ,  H05K3/40 ,  B23K101/36

摘要： A method includes forming one or more vias in a substrate, forming at least one liner on at least one sidewall of at least one of the vias, and filling said at least one via with solder material using injection molded soldering. The at least one liner may comprise a solder adhesion layer, a barrier layer, or a combination of a barrier layer and a solder adhesion layer.

公开(公告)号：US09861313B1

公开(公告)日：2018-01-09

申请号：US15214942

申请日：2016-07-20

申请人： International Business Machines Corporation

发明人： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC分类号： H01L41/113 ,  A61B5/00 ,  B23K3/06 ,  A61M5/00 ,  B23K101/36

CPC分类号： A61B5/68 ,  A61B2562/12 ,  A61M5/00 ,  A61M2207/00 ,  B23K3/0638 ,  B23K2101/36 ,  H01L21/486 ,  H01L21/76816 ,  H01L21/76852 ,  H01L21/76883 ,  H01L21/76898 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/53228 ,  H01L23/53238 ,  H01L23/53242 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/64 ,  H01L24/69 ,  H01L24/83 ,  H01L24/89 ,  H01L2223/6677 ,  H01L2224/27312 ,  H01L2224/32111 ,  H01L2224/32235 ,  H01L2224/325 ,  H01L2224/64 ,  H01L2224/69 ,  H01L2224/83801 ,  H01L2224/89 ,  H01L2224/96 ,  H01L2924/014 ,  H01L2924/1434 ,  H01L2924/15332 ,  H05K1/0306 ,  H05K3/4038 ,  H05K2201/0305

摘要： A method includes forming one or more trenches in a first substrate, forming one or more vias in a second substrate, aligning at least a first trench in the first substrate with at least a first via in the second substrate, and sealing the first substrate to the second substrate by filling the first via and the first trench with solder material using injection molded soldering.

公开(公告)号：US20180005982A1

公开(公告)日：2018-01-04

申请号：US15612190

申请日：2017-06-02

申请人： International Business Machines Corporation

发明人： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： A61B5/68 ,  A61B2562/12 ,  A61M5/00 ,  A61M2207/00 ,  B23K3/0638 ,  B23K2101/36 ,  H01L21/486 ,  H01L21/76816 ,  H01L21/76852 ,  H01L21/76883 ,  H01L21/76898 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/53228 ,  H01L23/53233 ,  H01L23/53238 ,  H01L23/53242 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/64 ,  H01L24/69 ,  H01L24/83 ,  H01L24/89 ,  H01L2223/6677 ,  H01L2224/27312 ,  H01L2224/32111 ,  H01L2224/32235 ,  H01L2224/325 ,  H01L2224/64 ,  H01L2224/69 ,  H01L2224/83801 ,  H01L2224/89 ,  H01L2224/96 ,  H01L2924/014 ,  H01L2924/1434 ,  H01L2924/15332 ,  H05K1/0306 ,  H05K3/4038 ,  H05K2201/0305

摘要： A method includes forming one or more vias in a first layer, forming one or more vias in at least a second layer different than the first layer, aligning at least a first via in the first layer with at least a second via in the second layer, and bonding the first layer to the second layer by filling the first via and the second via with solder material using injection molded soldering.

公开(公告)号：US20180000412A1

公开(公告)日：2018-01-04

申请号：US15214942

申请日：2016-07-20

申请人： International Business Machines Corporation

发明人： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC分类号： A61B5/00 ,  B23K3/06 ,  A61M5/00 ,  B23K101/36

CPC分类号： A61B5/68 ,  A61B2562/12 ,  A61M5/00 ,  A61M2207/00 ,  B23K3/0638 ,  B23K2101/36 ,  H01L21/486 ,  H01L21/76816 ,  H01L21/76852 ,  H01L21/76883 ,  H01L21/76898 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/53228 ,  H01L23/53238 ,  H01L23/53242 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/64 ,  H01L24/69 ,  H01L24/83 ,  H01L24/89 ,  H01L2223/6677 ,  H01L2224/27312 ,  H01L2224/32111 ,  H01L2224/32235 ,  H01L2224/325 ,  H01L2224/64 ,  H01L2224/69 ,  H01L2224/83801 ,  H01L2224/89 ,  H01L2224/96 ,  H01L2924/014 ,  H01L2924/1434 ,  H01L2924/15332 ,  H05K1/0306 ,  H05K3/4038 ,  H05K2201/0305

摘要： A method includes forming one or more trenches in a first substrate, forming one or more vias in a second substrate, aligning at least a first trench in the first substrate with at least a first via in the second substrate, and sealing the first substrate to the second substrate by filling the first via and the first trench with solder material using injection molded soldering.

公开(公告)号：US10750955B1

公开(公告)日：2020-08-25

申请号：US16299311

申请日：2019-03-12

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： John Knickerbocker ,  Shriya Kumar

IPC分类号： A61B5/0205 ,  G16H20/30 ,  G16H10/65 ,  G16H40/63 ,  A61B5/00 ,  A61B5/145 ,  A61B5/024

摘要： A health & fitness tracking device may include a display that provides fitness information to a wearer of the health & fitness tracking device, at least one physiological sensor that obtains physiological data by monitoring at least one physiological condition of the wearer, at least one environmental sensor that obtains environmental data by monitoring at least one environmental condition, a data storage device that stores the physiological data, the environmental data, and medical history data relating to the wearer, a memory storing a computer program, and a processor that executes the computer program. The computer program may adjust a sensor configuration of the at least one physiological sensor based on the medical history data.

公开(公告)号：US20180344245A1

公开(公告)日：2018-12-06

申请号：US16054366

申请日：2018-08-03

申请人： International Business Machines Corporation

发明人： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC分类号： A61B5/00 ,  H05K3/40 ,  A61M5/00 ,  B23K3/06 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/498 ,  H01L23/532 ,  H05K1/03 ,  H01L23/00 ,  H01L23/66 ,  H01L23/538 ,  B23K101/36

CPC分类号： A61B5/68 ,  A61B2562/12 ,  A61M5/00 ,  A61M2207/00 ,  B23K3/0638 ,  B23K2101/36 ,  H01L21/486 ,  H01L21/76816 ,  H01L21/76852 ,  H01L21/76883 ,  H01L21/76898 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/53228 ,  H01L23/53233 ,  H01L23/53238 ,  H01L23/53242 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/64 ,  H01L24/69 ,  H01L24/83 ,  H01L24/89 ,  H01L2223/6677 ,  H01L2224/27312 ,  H01L2224/32111 ,  H01L2224/32235 ,  H01L2224/325 ,  H01L2224/64 ,  H01L2224/69 ,  H01L2224/83801 ,  H01L2224/89 ,  H01L2224/96 ,  H01L2924/014 ,  H01L2924/1434 ,  H01L2924/15332 ,  H05K1/0306 ,  H05K3/4038 ,  H05K2201/0305

摘要： An apparatus includes a substrate having one or more vias formed therein. At least one of the vias has at least one liner disposed on at least one sidewall thereof. The apparatus also includes at least one interconnect formed through the at least one via. The one or more interconnects comprise a solder material filled using injection molded soldering.