Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.