公开(公告)号：US09978674B2

公开(公告)日：2018-05-22

申请号：US15479856

申请日：2017-04-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-woo Kim ,  Jae-min Jung ,  Ji-yong Park ,  Jeong-kyu Ha ,  Woon-bae Kim

IPC: H01L33/48 ,  H01L23/498 ,  H01L23/00 ,  H01L23/29 ,  H01L23/488 ,  H01L33/62

CPC classification number: H01L23/4985 ,  H01L23/29 ,  H01L23/488 ,  H01L23/4922 ,  H01L24/29 ,  H01L24/32 ,  H01L25/167 ,  H01L33/48 ,  H01L33/62 ,  H01L2924/143 ,  H01L2924/186

Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.

公开(公告)号：US10134667B2

公开(公告)日：2018-11-20

申请号：US15964342

申请日：2018-04-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-woo Kim ,  Jae-min Jung ,  Ji-yong Park ,  Jeong-kyu Ha ,  Woon-bae Kim

IPC: H01L33/48 ,  H01L23/498 ,  H01L23/29 ,  H01L23/00 ,  H01L23/488 ,  H01L33/62 ,  H01L23/492 ,  H01L25/16

Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.

公开(公告)号：US20180247882A1

公开(公告)日：2018-08-30

申请号：US15964342

申请日：2018-04-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-woo Kim ,  Jae-min Jung ,  Ji-yong Park ,  Jeong-kyu Ha ,  Woon-bae Kim

IPC: H01L23/498 ,  H01L23/29 ,  H01L23/00 ,  H01L33/62 ,  H01L23/488 ,  H01L33/48

CPC classification number: H01L23/4985 ,  H01L23/29 ,  H01L23/488 ,  H01L23/4922 ,  H01L24/29 ,  H01L24/32 ,  H01L25/167 ,  H01L33/48 ,  H01L33/62 ,  H01L2924/143 ,  H01L2924/186

Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.