Invention Grant
- Patent Title: Manufacturing method of array substrate, array substrate and display device
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Application No.: US15325402Application Date: 2016-03-09
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Publication No.: US10141352B2Publication Date: 2018-11-27
- Inventor: Zhanfeng Cao , Feng Zhang , Bin Zhang , Xiaolong He , Zhengliang Li , Wei Zhang , Feng Guan , Jincheng Gao
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Armstrong Teasdale LLP
- Priority: CN201510614230 20150923
- International Application: PCT/CN2016/075984 WO 20160309
- International Announcement: WO2017/049885 WO 20170330
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/77

Abstract:
A manufacturing method of an array substrate is provided. The method includes sequentially depositing a first electrode layer and a gate metal layer on a base substrate, the first electrode layer including at least two conductive layers, formation materials of the at least two conductive layers having different etching rates. The method also includes forming a photoresist layer on the gate metal layer, exposing and developing the photoresist layer using a halftone mask plate, performing a first etching process on the gate metal layer, etching the first electrode layer, and ashing the photoresist layer, performing a second etching process on the gate metal layer by using remaining photoresist layer as a mask, stripping the remaining photoresist layer, and sequentially forming a semiconductor layer, a source and drain electrode layer, a via-hole and a second electrode layer on the gate metal layer on which the second etching process has been performed.
Public/Granted literature
- US20170294461A1 MANUFACTURING METHOD OF ARRAY SUBSTRATE, ARRAY SUBSTRATE AND DISPLAY DEVICE Public/Granted day:2017-10-12
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