Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US15667629Application Date: 2017-08-03
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Publication No.: US10164052B2Publication Date: 2018-12-25
- Inventor: Chia-Fu Hsu , Chun-Mao Chiou , Shih-Chieh Hsu , Lung-En Kuo , You-Di Jhang , Jian-Cun Ke
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: TW103119927A 20140609
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/51 ; H01L29/66 ; H01L29/40 ; H01L29/78

Abstract:
A semiconductor device includes an interfacial layer on a substrate and agate structure on the interfacial layer. Preferably, the gate structure includes a patterned high-k dielectric layer, the patterned high-k dielectric layer comprises a metal oxide layer, and a horizontal direction width of the patterned high-k dielectric layer and a horizontal direction width of the interfacial layer are different. The semiconductor device also includes a first spacer adjacent to the gate structure and on part of the interfacial layer and contacting a top surface of the interfacial layer and a second spacer on the sidewalls of the first spacer and the interfacial layer. Preferably, a planar bottom surface of the second spacer is lower than a planar bottom surface of the first spacer and extending along a same direction as the planar bottom surface of the first spacer.
Public/Granted literature
- US20170330954A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2017-11-16
Information query
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