发明授权
- 专利标题： Support structure for electronics having fluid passageway for convective heat transfer
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申请号： US15474486申请日： 2017-03-30
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公开(公告)号： US10178800B2公开(公告)日： 2019-01-08
- 发明人: Saravana Mahalingam , Abhay Naik , Yathiraj Kasal , Rakesh Hota , Rajendra Prasad Vrukshavai , Mathews Leslie Kuriakose , Ravi Anekal Radhakrishnan
- 申请人： HONEYWELL INTERNATIONAL INC.
- 申请人地址： US NJ Morris Plains
- 专利权人： HONEYWELL INTERNATIONAL INC.
- 当前专利权人： HONEYWELL INTERNATIONAL INC.
- 当前专利权人地址： US NJ Morris Plains
- 代理机构： Lorenz & Kopf, LLP
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; H05K7/14
摘要：
A support structure for an electronic component a chassis and a standoff that is attached to the chassis. The standoff is configured to support the electronic component and separate the electronic component at a distance away from the chassis. The standoff is configured to receive heat generated by the electronic component. The standoff includes a fluid passageway. The fluid passageway is configured to allow a cooling fluid to flow therethrough for convective heat transfer from the standoff to the cooling fluid.
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