公开(公告)号：US10178800B2

公开(公告)日：2019-01-08

申请号：US15474486

申请日：2017-03-30

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Saravana Mahalingam ,  Abhay Naik ,  Yathiraj Kasal ,  Rakesh Hota ,  Rajendra Prasad Vrukshavai ,  Mathews Leslie Kuriakose ,  Ravi Anekal Radhakrishnan

IPC: H05K7/20 ,  H05K7/14

Abstract: A support structure for an electronic component a chassis and a standoff that is attached to the chassis. The standoff is configured to support the electronic component and separate the electronic component at a distance away from the chassis. The standoff is configured to receive heat generated by the electronic component. The standoff includes a fluid passageway. The fluid passageway is configured to allow a cooling fluid to flow therethrough for convective heat transfer from the standoff to the cooling fluid.

公开(公告)号：US10913538B2

公开(公告)日：2021-02-09

申请号：US16268559

申请日：2019-02-06

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Daniel C. Birchak ,  Albert Kang ,  Darrell Horner ,  John Perek ,  Abhay Naik ,  Jagadeesh Hariwal ,  William F. Ryan ,  Doug Smith ,  Bharath Chandra G ,  Saravana Mahalingam

IPC: B64D13/02 ,  B64D13/00

Abstract: Outflow valve (OFV) assemblies including non-metallic frames and enhanced attachment features are provided. In embodiments, the OFV assembly includes a non-metallic frame to which at least one valve door is pivotally mounted. The non-metallic frame may, in turn, include a generally rectangular frame body, a central opening through the frame body, an outer peripheral flange extending around at least a portion of the frame body. Frame attachment interfaces are distributed or spaced around the outer peripheral flange of the non-metallic frame. The frame attachment interfaces include fastener openings and elevated platform regions, which project from an inboard side of the outer peripheral flange and through which the fastener openings extend. Base plates seat against the elevated platform regions. Fasteners engage the base plates and extend through the fastener openings to an outboard side of the outer peripheral flange to attach the OFV assembly to an aircraft fuselage.

公开(公告)号：US20200247549A1

公开(公告)日：2020-08-06

申请号：US16268559

申请日：2019-02-06

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Daniel C. Birchak ,  Albert Kang ,  Darrell Horner ,  John Perek ,  Abhay Naik ,  Jagadeesh Hariwal ,  William F. Ryan ,  Doug Smith ,  Bharath Chandra G ,  Saravana Mahalingam

IPC: B64D13/02 ,  B64D13/00

Abstract: Outflow valve (OFV) assemblies including non-metallic frames and enhanced attachment features are provided. In embodiments, the OFV assembly includes a non-metallic frame to which at least one valve door is pivotally mounted. The non-metallic frame may, in turn, include a generally rectangular frame body, a central opening through the frame body, an outer peripheral flange extending around at least a portion of the frame body. Frame attachment interfaces are distributed or spaced around the outer peripheral flange of the non-metallic frame. The frame attachment interfaces include fastener openings and elevated platform regions, which project from an inboard side of the outer peripheral flange and through which the fastener openings extend. Base plates seat against the elevated platform regions. Fasteners engage the base plates and extend through the fastener openings to an outboard side of the outer peripheral flange to attach the OFV assembly to an aircraft fuselage.

公开(公告)号：US20180288900A1

公开(公告)日：2018-10-04

申请号：US15474486

申请日：2017-03-30

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Saravana Mahalingam ,  Abhay Naik ,  Yathiraj Kasal ,  Rakesh Hota ,  Rajendra Prasad Vrukshavai ,  Mathews Leslie Kuriakose ,  Ravi Anekal Radhakrishnan

IPC: H05K7/20 ,  H05K7/14

CPC classification number: H05K7/20263 ,  H05K7/1427 ,  H05K7/20272

Abstract: A support structure for an electronic component a chassis and a standoff that is attached to the chassis. The standoff is configured to support the electronic component and separate the electronic component at a distance away from the chassis. The standoff is configured to receive heat generated by the electronic component. The standoff includes a fluid passageway. The fluid passageway is configured to allow a cooling fluid to flow therethrough for convective heat transfer from the standoff to the cooling fluid.