公开(公告)号：US10178800B2

公开(公告)日：2019-01-08

申请号：US15474486

申请日：2017-03-30

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Saravana Mahalingam ,  Abhay Naik ,  Yathiraj Kasal ,  Rakesh Hota ,  Rajendra Prasad Vrukshavai ,  Mathews Leslie Kuriakose ,  Ravi Anekal Radhakrishnan

IPC: H05K7/20 ,  H05K7/14

Abstract: A support structure for an electronic component a chassis and a standoff that is attached to the chassis. The standoff is configured to support the electronic component and separate the electronic component at a distance away from the chassis. The standoff is configured to receive heat generated by the electronic component. The standoff includes a fluid passageway. The fluid passageway is configured to allow a cooling fluid to flow therethrough for convective heat transfer from the standoff to the cooling fluid.

公开(公告)号：US20180288900A1

公开(公告)日：2018-10-04

申请号：US15474486

申请日：2017-03-30

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Saravana Mahalingam ,  Abhay Naik ,  Yathiraj Kasal ,  Rakesh Hota ,  Rajendra Prasad Vrukshavai ,  Mathews Leslie Kuriakose ,  Ravi Anekal Radhakrishnan

IPC: H05K7/20 ,  H05K7/14

CPC classification number: H05K7/20263 ,  H05K7/1427 ,  H05K7/20272

Abstract: A support structure for an electronic component a chassis and a standoff that is attached to the chassis. The standoff is configured to support the electronic component and separate the electronic component at a distance away from the chassis. The standoff is configured to receive heat generated by the electronic component. The standoff includes a fluid passageway. The fluid passageway is configured to allow a cooling fluid to flow therethrough for convective heat transfer from the standoff to the cooling fluid.