公开(公告)号：US10178800B2

公开(公告)日：2019-01-08

申请号：US15474486

申请日：2017-03-30

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Saravana Mahalingam ,  Abhay Naik ,  Yathiraj Kasal ,  Rakesh Hota ,  Rajendra Prasad Vrukshavai ,  Mathews Leslie Kuriakose ,  Ravi Anekal Radhakrishnan

IPC: H05K7/20 ,  H05K7/14

Abstract: A support structure for an electronic component a chassis and a standoff that is attached to the chassis. The standoff is configured to support the electronic component and separate the electronic component at a distance away from the chassis. The standoff is configured to receive heat generated by the electronic component. The standoff includes a fluid passageway. The fluid passageway is configured to allow a cooling fluid to flow therethrough for convective heat transfer from the standoff to the cooling fluid.

公开(公告)号：US20180288900A1

公开(公告)日：2018-10-04

申请号：US15474486

申请日：2017-03-30

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Saravana Mahalingam ,  Abhay Naik ,  Yathiraj Kasal ,  Rakesh Hota ,  Rajendra Prasad Vrukshavai ,  Mathews Leslie Kuriakose ,  Ravi Anekal Radhakrishnan

IPC: H05K7/20 ,  H05K7/14

CPC classification number: H05K7/20263 ,  H05K7/1427 ,  H05K7/20272

Abstract: A support structure for an electronic component a chassis and a standoff that is attached to the chassis. The standoff is configured to support the electronic component and separate the electronic component at a distance away from the chassis. The standoff is configured to receive heat generated by the electronic component. The standoff includes a fluid passageway. The fluid passageway is configured to allow a cooling fluid to flow therethrough for convective heat transfer from the standoff to the cooling fluid.

公开(公告)号：US10579258B2

公开(公告)日：2020-03-03

申请号：US16036299

申请日：2018-07-16

Applicant: Honeywell International Inc.

Inventor： Stephen Mead ,  Keerthi Jayarajan ,  Rajendra Prasad Vrukshavai ,  Sareesh Sivarajan ,  Satyanarayan Kar

IPC: G06F3/0488 ,  G06F3/0481 ,  G09G3/32 ,  G06F3/042

Abstract: A customizable gesture controller is disclosed for retro-fitting and forward-fitting into existing spaces or structures. One embodiment of the controller comprises a controller board configured to host software; a response layer comprising a plurality of sections arranged sequentially, each of the plurality of sections comprising: one or more center LEDs; one or more runway LEDs; and one or more touch sensors; and an overlay comprising: a glass overlay layer; and a graphic overlay layer comprising a plurality of button icons corresponding to the plurality of sections. The response layer further comprises one or more marks positioned at boundaries between each of the plurality of sections, the one or more marks being configured to identify locations at which to adjust lengths of the response layer using an application of force.