Invention Grant
- Patent Title: Method for metalizing polymer substrate and polymer article prepared thereof
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Application No.: US15217730Application Date: 2016-07-22
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Publication No.: US10179949B2Publication Date: 2019-01-15
- Inventor: Qing Gong , Wei Zhou , Yongliang Sun
- Applicant: BYD COMPANY LIMITED
- Applicant Address: CN Shenzhen
- Assignee: BYD Company Limited
- Current Assignee: BYD Company Limited
- Current Assignee Address: CN Shenzhen
- Agency: Sheppard Mullin Richter & Hampton LLP
- Priority: CN201410040525 20140127; CN201410040821 20140127; CN201410041075 20140127
- Main IPC: B05D3/00
- IPC: B05D3/00 ; C08J7/18 ; G21H5/00 ; C23C18/18 ; C23C18/16 ; C23C18/20 ; C23C18/40 ; C08K3/20 ; C23C18/36 ; C23C18/54 ; C08K3/22
Abstract:
A method for metalizing a polymer substrate and a polymer article prepared thereof. First, a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then, a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. The surface of the polymer substrate is then subjected to chemical plating.
Public/Granted literature
- US20160333481A1 METHOD FOR METALIZING POLYMER SUBSTRATE AND POLYMER ARTICLE PREPARED THEREOF Public/Granted day:2016-11-17
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