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    Method for selectively metallizing surface of ceramic substrate, ceramic product and use of ceramic product
    1.
    发明授权
    Method for selectively metallizing surface of ceramic substrate, ceramic product and use of ceramic product 有权

    公开(公告)号：US11382216B2

    公开(公告)日：2022-07-05

    申请号：US16274103

    申请日：2019-02-12

    Applicant: BYD COMPANY LIMITED

    Inventor： Qing Gong ,  Xinping Lin ,  Yongpeng Ren ,  Baoxiang Zhang

    IPC: H05K3/18 ,  C04B41/88 ,  C04B41/00 ,  C04B41/51 ,  C23C18/06 ,  C23C18/12 ,  C23C18/16 ,  H05K1/03 ,  C04B111/00

    Abstract: A method for selectively metallizing a surface of a ceramic substrate, a ceramic product and use of the ceramic product are provided. The method comprises steps of: A) molding and sintering a ceramic composition to obtain the ceramic substrate, in which the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder; the ceramic powder is at least one selected from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E; E at least one selected from a group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, B, Al, Ga, Si, Ge, P, As, Sc, Y, Zr, Hf, is and lanthanide elements; the functional powder is at least one selected from a group consisting of an oxide of M, a nitride of M, a oxynitride of M, a carbide of M, and a simple substance of M; and M is at least one selected from a group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, In, Sn, Sb, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; B) radiating a predetermined region of the surface of the ceramic substrate using an energy beam to form a chemical plating active center on the predetermined region of the surface of the ceramic substrate; and C) performing chemical plating on the ceramic substrate formed with the chemical plating active center to form a metal layer on the predetermined region of the surface of the ceramic substrate.

    METAL SHELL AND CELL PHONE COMPRISING THE SAME
    5.
    发明申请
    METAL SHELL AND CELL PHONE COMPRISING THE SAME 审中-公开
    金属壳和包含它的电话

    公开(公告)号：US20160119012A1

    公开(公告)日：2016-04-28

    申请号：US14891263

    申请日：2014-06-24

    Applicant: BYD COMPANY LIMITED

    Inventor： Jiangang Zhou ,  Dajun Chen ,  Qing Gong

    IPC: H04B1/3888 ,  H04B5/02 ,  H04M1/02

    CPC classification number: H04B1/3888 ,  H01Q1/405 ,  H01Q7/00 ,  H04B5/0081 ,  H04B5/02 ,  H04M1/0202 ,  H04M2250/04

    Abstract: A metal shell includes: a metal body having a through hole; a plastic member disposed on the metal body at a position of the through hole; and a NFC antenna disposed on a surface of the plastic member and configured to receive a signal via the through hole. An area of a part of the NFC antenna overlapping the through hole is larger than one third of an area of the NFC antenna. A cell phone including the metal shell is also provided.

    Abstract translation: 金属壳包括：具有通孔的金属体; 塑料构件，其设置在所述金属体的通孔的位置; 以及NFC天线，其设置在所述塑料构件的表面上并且被配置为经由所述通孔接收信号。 NFC天线的与通孔重叠的部分的区域大于NFC天线的面积的三分之一。 还提供了包括金属外壳的手机。

    Metalized plastic articles and methods thereof
    8.
    发明授权
    Metalized plastic articles and methods thereof 有权

    公开(公告)号：US10392708B2

    公开(公告)日：2019-08-27

    申请号：US14576950

    申请日：2014-12-19

    Applicant: BYD COMPANY LIMITED

    Inventor： Qing Gong ,  Liang Zhou ,  Weifeng Miao ,  Xiong Zhang

    IPC: C23C28/02 ,  C23C18/20 ,  C23C18/16 ,  B05D1/36 ,  B05D3/06 ,  B05D7/00 ,  C23C18/50 ,  C25D5/56

    Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

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