Invention Grant
- Patent Title: Method for manufacturing light emitting device
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Application No.: US15697953Application Date: 2017-09-07
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Publication No.: US10193032B2Publication Date: 2019-01-29
- Inventor: Shogo Abe , Tadayuki Kitajima
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Global IP Counselors, LLP
- Priority: JP2016-192769 20160930
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/54 ; H01L33/20 ; H01L33/58 ; H01L33/48 ; H01L33/60

Abstract:
A method for manufacturing a light emitting device includes: providing a substrate including a placement region for placing a light emitting element on a top surface; mounting the light emitting element in the placement region; and forming a frame body surrounding the placement region on the substrate. The step of forming the frame body is performed by arranging a first frame body and second frame body on the substrate to surround the placement region. The second frame body have a larger diameter than the first frame body, and have the same thickness as the first frame body.
Public/Granted literature
- US20180097155A1 METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE Public/Granted day:2018-04-05
Information query
IPC分类: