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公开(公告)号：US11521956B2
公开(公告)日：2022-12-06
申请号：US17207595
申请日：2021-03-19
Applicant: NICHIA CORPORATION
Inventor： Shogo Abe , Yuki Ogura
IPC: H01L25/075 , H01L33/50 , H01L33/54 , H01L33/60 , H01L33/62 , H01L33/56 , H01L33/48 , F21S41/151 , F21S45/10 , F21S41/19 , H01L25/16
Abstract: A method of manufacturing a light-emitting device includes: providing a first intermediate structure including a substrate, light-emitting elements arrayed in a first direction, a protective element, and light-transmissive members; forming a resin wall including first and second walls extending in the first direction, and third and fourth walls, a first distance between the first wall and the light-emitting elements being larger than a second distance between the third or fourth wall and a corresponding one of light-emitting elements; applying a first resin to a first region between the first wall and the light-emitting elements in which the protective element is disposed, resulting in forming a first recess in the first region and a second recess in a second region between the second wall and the light-emitting elements; and forming a covering member by applying a second resin to the first and second recesses and curing the first and second resins.
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Patent Agency Ranking
公开(公告)号：US10193032B2
公开(公告)日：2019-01-29
申请号：US15697953
申请日：2017-09-07
Applicant: NICHIA CORPORATION
Inventor： Shogo Abe , Tadayuki Kitajima
Abstract: A method for manufacturing a light emitting device includes: providing a substrate including a placement region for placing a light emitting element on a top surface; mounting the light emitting element in the placement region; and forming a frame body surrounding the placement region on the substrate. The step of forming the frame body is performed by arranging a first frame body and second frame body on the substrate to surround the placement region. The second frame body have a larger diameter than the first frame body, and have the same thickness as the first frame body.
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公开(公告)号：US11456402B2
公开(公告)日：2022-09-27
申请号：US16995016
申请日：2020-08-17
Applicant: NICHIA CORPORATION
Inventor： Shogo Abe , Keita Shimizu , Takashi Kadota
Abstract: A light-emitting device includes: a package defining a recess; a light-emitting element mounted on surface that defines a bottom of the recess; and a sealing member disposed in the recess so as to cover the light-emitting element and made of a light-transmissive resin that contains a filler with an average particle diameter of 200 nm or more and 500 nm or less. The sealing member comprises a filler-containing layer, which contains the filler, and a light-transmissive layer that are layered in an order from a bottom side of the recess. The filler-containing layer has a thickness of equal to or larger than a height of the light-emitting element.
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公开(公告)号：US10186633B2
公开(公告)日：2019-01-22
申请号：US15683238
申请日：2017-08-22
Applicant: NICHIA CORPORATION
Inventor： Satoshi Shichijo , Kunihito Sugimoto , Kenji Ozeki , Shogo Abe
Abstract: A method of manufacturing a light emitting device includes: forming a light-transmissive member that is substantially rectangular in a plan view to cover an upper surface of a light emitting element mounted on a base member; and forming a frame body so as to surround the light-transmissive member, wherein, in the step of forming the frame body, the frame body is formed such that a distance from an upper surface of the base member to an upper end of the frame body is smaller along a short side of the light-transmissive member than along a long side of the light-transmissive member.
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公开(公告)号：US11735687B2
公开(公告)日：2023-08-22
申请号：US17179320
申请日：2021-02-18
Applicant: NICHIA CORPORATION
Inventor： Shogo Abe , Yuki Ogura
CPC classification number: H01L33/0095 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
Abstract: A method of manufacturing a light emitting device includes: providing a first intermediate body including a substrate, first bonding members, a second bonding member, a light emitting element, a protecting element, a light transmissive member bonded to the light emitting element, and a light-shielding frame surrounding the light transmissive member in a top view, a portion of an outer periphery of the light-shielding frame being located above the protecting element such that at least a portion of the protecting element is exposed from the light-shielding frame in the top view; disposing a first resin between the light emitting element and the substrate by applying the first resin on the substrate in a region outside of the portion of the protecting element such that the first resin moves toward the light emitting element along the protecting element; and curing the first resin to obtain a first cover member.
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公开(公告)号：US09780258B2
公开(公告)日：2017-10-03
申请号：US15216321
申请日：2016-07-21
Applicant: NICHIA CORPORATION
Inventor： Satoshi Shichijo , Kunihito Sugimoto , Kenji Ozeki , Shogo Abe
CPC classification number: H01L33/20 , H01L25/0753 , H01L25/167 , H01L33/505 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2933/0041 , H01L2933/0058
Abstract: A light emitting device includes a base member; a light emitting element mounted on the base member; a light-transmissive member that covers an upper surface of the light emitting element, and is substantially rectangular in a plan view; and a light reflecting member that covers a lateral surface of the light-transmissive member, the light reflecting member having a substantially rectangular frame shape in a plan view. A width of the light reflecting member is smaller along a short side of the light-transmissive member than along a long side of the light-transmissive member. A height of the light reflecting member is smaller along the short side of the light-transmissive member than along the long side of the light-transmissive member at a position separated from an outer edge of the light reflecting member by a predetermined distance.
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