公开(公告)号：US12215857B2

公开(公告)日：2025-02-04

申请号：US18258880

申请日：2021-12-22

Applicant: NICHIA CORPORATION

Inventor： Tadayuki Kitajima

IPC: F21V7/04 ,  F21V9/30 ,  F21Y113/00

Abstract: A light emitting device includes: a base member including a mounting surface, a first light-emitting element that is disposed on the mounting surface and emits light passing along a first optical axis, a second light-emitting element that is disposed on the mounting surface and emits light passing along a second optical axis, a third light-emitting element that is disposed on the mounting surface and emits light passing along a third optical axis, and one or more light reflective members including a first light reflective surface that includes a first position to be irradiated with the light passing along the first optical axis, a second light reflective surface that includes a second position to be irradiated with the light passing along the second optical axis and, and a third light reflective surface that includes a third position to be irradiated with the light passing along the third optical axis.

公开(公告)号：US10978852B2

公开(公告)日：2021-04-13

申请号：US16365975

申请日：2019-03-27

Applicant: NICHIA CORPORATION

Inventor： Tadayuki Kitajima

IPC: H01S5/022 ,  H01S5/024 ,  H01S5/042 ,  H01S5/40 ,  H01S5/00 ,  H01S5/068 ,  H01S5/02216

Abstract: A light emitting device includes a package body, a light-transmissive cover, one or more semiconductor laser elements, a wavelength converting member, a wiring, electrically conductive layers, an opaque electrically insulating member, and electrodes. The light-transmissive cover is secured to the package body. The wavelength converting member is disposed above the light-transmissive cover in an optical path of the laser light emitted from the semiconductor laser element. The wiring is disposed on a light incidence surface-side of the wavelength converting member. The electrically conductive layers are electrically connected to the wiring and disposed on an upper surface of the light-transmissive cover. The electrically insulating member at least partially covers the electrically conductive layers and the light-transmissive cover. The electrodes are disposed on a surface of the package body at locations outward of the electrically insulating member in a plan view, and electrically connected to the electrically conductive layers.

公开(公告)号：US10193032B2

公开(公告)日：2019-01-29

申请号：US15697953

申请日：2017-09-07

Applicant: NICHIA CORPORATION

Inventor： Shogo Abe ,  Tadayuki Kitajima

IPC: H01L33/00 ,  H01L33/54 ,  H01L33/20 ,  H01L33/58 ,  H01L33/48 ,  H01L33/60

Abstract: A method for manufacturing a light emitting device includes: providing a substrate including a placement region for placing a light emitting element on a top surface; mounting the light emitting element in the placement region; and forming a frame body surrounding the placement region on the substrate. The step of forming the frame body is performed by arranging a first frame body and second frame body on the substrate to surround the placement region. The second frame body have a larger diameter than the first frame body, and have the same thickness as the first frame body.

公开(公告)号：US11962121B2

公开(公告)日：2024-04-16

申请号：US18302570

申请日：2023-04-18

Applicant: NICHIA CORPORATION

Inventor： Tadayuki Kitajima ,  Tomokazu Taji

IPC: H01S5/02375 ,  H01S5/00

CPC classification number: H01S5/02375 ,  H01S5/0071

Abstract: A light emitting device includes a semiconductor laser element, a base member, and a cover. The base member includes a first alignment mark, a second alignment mark, a third alignment mark, and a fourth alignment mark. The base member has a disposition surface on which the semiconductor laser element is disposed. The cover is bonded to the base member to define a closed space in which the semiconductor laser element is arranged. The first alignment mark and the second alignment mark are arranged outside the closed space. The third alignment mark and the fourth alignment mark are arranged inside the closed space. A straight line connecting the first alignment mark and the second alignment mark is parallel to a straight line connecting the third alignment mark and the fourth alignment mark.

公开(公告)号：US10920937B2

公开(公告)日：2021-02-16

申请号：US16259989

申请日：2019-01-28

Applicant: NICHIA CORPORATION

Inventor： Tadayuki Kitajima ,  Soichiro Miura

IPC: F21V7/10 ,  F21K9/64 ,  F21V13/10 ,  F21V11/16 ,  H01S5/00 ,  H01S5/022 ,  F21Y115/30 ,  H01S5/02216 ,  H01S5/40

Abstract: A light emitting device includes: a base; a first semiconductor laser element disposed on an upper surface of the base and configured to emit first light; a first light reflecting member disposed on the upper surface of the base and configured to reflect the first light upwards; a phosphor member having a lower surface onto which the first light is irradiated and an upper surface serving as a light extraction surface; and a light shielding member surrounding lateral surfaces of the phosphor member. First and second regions of the first light reflecting member are formed such that a portion of the light reflected by the first region that is reflected on a side close to the second region and a portion of the light reflected by the second region that is reflected on a side close to the first region intersect before reaching the lower surface of the phosphor member.

公开(公告)号：US09627591B2

公开(公告)日：2017-04-18

申请号：US15050713

申请日：2016-02-23

Applicant: NICHIA CORPORATION

Inventor： Masashi Ishida ,  Yoshiyuki Ide ,  Tatsuya Hayashi ,  Tadayuki Kitajima ,  Takeshi Aki

IPC: H01L23/00 ,  H01L33/48 ,  H01L33/62 ,  H05K1/11 ,  H01L23/498

CPC classification number: H01L33/486 ,  H01L23/49838 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/12041 ,  H05K1/111 ,  H05K1/115 ,  H05K3/3431 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/10106 ,  Y02P70/611

Abstract: A mounting substrate includes: a base; and at least one pair of wiring patterns disposed apart from each other on the base. At least one of the wiring patterns has a mounting portion, which is configured to support an electronic part thereon and which is rectangular in a plan view. The at least one of the wiring patterns defines a hole, which exposes a part of the base and which is disposed in at least a part of an outer edge of the mounting portion.

公开(公告)号：US11527864B2

公开(公告)日：2022-12-13

申请号：US17148843

申请日：2021-01-14

Applicant: NICHIA CORPORATION

Inventor： Tadayuki Kitajima ,  Soichiro Miura

IPC: F21V7/10 ,  H01S5/02255 ,  F21K9/64 ,  F21V13/10 ,  F21V11/16 ,  H01S5/02257 ,  H01S5/00 ,  F21Y115/30 ,  H01S5/02216 ,  H01S5/40

Abstract: A light emitting device includes: a base; a first semiconductor laser element disposed on an upper surface of the base and configured to emit first light; a first light reflecting member disposed on the upper surface of the base, the first light reflecting member having a first light reflecting face including a plane configured to reflect the first light; a second semiconductor laser element disposed on an upper surface of the base and configured to emit second light; a second light reflecting member disposed on the upper surface of the base, the second light reflecting member having a second light reflecting face including a plane configured to reflect the second light; and a phosphor member onto which the first light reflected from the first light reflecting member and the second light reflected from the second light reflecting member are irradiated.

公开(公告)号：US11303095B2

公开(公告)日：2022-04-12

申请号：US16791791

申请日：2020-02-14

Applicant: NICHIA CORPORATION

Inventor： Tadayuki Kitajima ,  Tomokazu Taji

IPC: H01S5/02375 ,  H01S5/00

Abstract: A method of manufacturing a light emitting device, the method including: disposing a first semiconductor laser element on a disposition surface of a base member such that a light emission end surface of the first semiconductor laser element is parallel to a first line passing through a pair of alignment marks provided on the base member; and disposing a first light-reflective member on the disposition surface such that a reference line for the first light-reflective member, which serves as an alignment reference in disposing the first light-reflective member, is parallel to a second line that is oblique to the first line at a predetermined angle.

公开(公告)号：US09276180B2

公开(公告)日：2016-03-01

申请号：US14074084

申请日：2013-11-07

Applicant: NICHIA CORPORATION

Inventor： Masashi Ishida ,  Daisuke Sato ,  Tadayuki Kitajima

IPC: H01L33/54 ,  H01L33/60 ,  H01L33/48 ,  H01L33/52 ,  H01L23/28 ,  H01L23/31 ,  H01L25/075 ,  H01L23/00 ,  H01L33/50

CPC classification number: H01L23/31 ,  H01L23/28 ,  H01L23/3135 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/48 ,  H01L33/483 ,  H01L33/502 ,  H01L33/505 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A manufacturing method of a light emitting device includes a light emitting element disposed over a substrate and a reflective resin disposed along the side surface of the light emitting element. The method includes disposing light emitting elements in a matrix over an aggregate substrate, and disposing a semiconductor element between the adjacent light emitting elements in one direction of column and row directions of the light emitting elements in the matrix. A reflective resin is disposed to cover the semiconductor elements along the side surfaces of the light emitting elements and the side surfaces of the phosphor layers. The reflective resin and the substrate disposed in between the adjacent light emitting elements is cut in the column or row direction and between the light emitting element and the adjacent semiconductor element in the other direction, to include a light emitting element or a semiconductor element.

公开(公告)号：US11664638B2

公开(公告)日：2023-05-30

申请号：US17688678

申请日：2022-03-07

Applicant: NICHIA CORPORATION

Inventor： Tadayuki Kitajima ,  Tomokazu Taji

IPC: H01S5/02375 ,  H01S5/00

CPC classification number: H01S5/02375 ,  H01S5/0071

Abstract: A light emitting device includes one or more electrical components and a base member. The electrical components include a first semiconductor laser element, which has a light emission end surface. The base member has a first surface on which the first semiconductor laser element is disposed. The base member includes a plurality of metal films including a first metal film and a second metal film. The first metal film is electrically connected to at least one of the electrical components, and defines a first alignment mark for aligning the first semiconductor laser element. The second metal film is electrically connected to at least one of the electrical components, and defines a second alignment mark for aligning the first semiconductor laser element. A straight line connecting the first alignment mark and the second alignment mark extends parallel to the light emission end surface of the first semiconductor laser element.