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    Light emitting device
    1.
    发明授权
    Light emitting device 有权

    公开(公告)号：US10978852B2

    公开(公告)日：2021-04-13

    申请号：US16365975

    申请日：2019-03-27

    申请人： NICHIA CORPORATION

    发明人： Tadayuki Kitajima

    IPC分类号： H01S5/022 ,  H01S5/024 ,  H01S5/042 ,  H01S5/40 ,  H01S5/00 ,  H01S5/068 ,  H01S5/02216

    摘要： A light emitting device includes a package body, a light-transmissive cover, one or more semiconductor laser elements, a wavelength converting member, a wiring, electrically conductive layers, an opaque electrically insulating member, and electrodes. The light-transmissive cover is secured to the package body. The wavelength converting member is disposed above the light-transmissive cover in an optical path of the laser light emitted from the semiconductor laser element. The wiring is disposed on a light incidence surface-side of the wavelength converting member. The electrically conductive layers are electrically connected to the wiring and disposed on an upper surface of the light-transmissive cover. The electrically insulating member at least partially covers the electrically conductive layers and the light-transmissive cover. The electrodes are disposed on a surface of the package body at locations outward of the electrically insulating member in a plan view, and electrically connected to the electrically conductive layers.

    Method for manufacturing light emitting device
    2.
    发明授权
    Method for manufacturing light emitting device 有权

    公开(公告)号：US10193032B2

    公开(公告)日：2019-01-29

    申请号：US15697953

    申请日：2017-09-07

    申请人： NICHIA CORPORATION

    发明人： Shogo Abe ,  Tadayuki Kitajima

    IPC分类号： H01L33/00 ,  H01L33/54 ,  H01L33/20 ,  H01L33/58 ,  H01L33/48 ,  H01L33/60

    摘要： A method for manufacturing a light emitting device includes: providing a substrate including a placement region for placing a light emitting element on a top surface; mounting the light emitting element in the placement region; and forming a frame body surrounding the placement region on the substrate. The step of forming the frame body is performed by arranging a first frame body and second frame body on the substrate to surround the placement region. The second frame body have a larger diameter than the first frame body, and have the same thickness as the first frame body.

    Light emitting device
    3.
    发明授权
    Light emitting device 有权

    公开(公告)号：US10920937B2

    公开(公告)日：2021-02-16

    申请号：US16259989

    申请日：2019-01-28

    申请人： NICHIA CORPORATION

    发明人： Tadayuki Kitajima ,  Soichiro Miura

    IPC分类号： F21V7/10 ,  F21K9/64 ,  F21V13/10 ,  F21V11/16 ,  H01S5/00 ,  H01S5/022 ,  F21Y115/30 ,  H01S5/02216 ,  H01S5/40

    摘要： A light emitting device includes: a base; a first semiconductor laser element disposed on an upper surface of the base and configured to emit first light; a first light reflecting member disposed on the upper surface of the base and configured to reflect the first light upwards; a phosphor member having a lower surface onto which the first light is irradiated and an upper surface serving as a light extraction surface; and a light shielding member surrounding lateral surfaces of the phosphor member. First and second regions of the first light reflecting member are formed such that a portion of the light reflected by the first region that is reflected on a side close to the second region and a portion of the light reflected by the second region that is reflected on a side close to the first region intersect before reaching the lower surface of the phosphor member.

    Light emitting device
    5.
    发明授权
    Light emitting device 有权

    公开(公告)号：US11527864B2

    公开(公告)日：2022-12-13

    申请号：US17148843

    申请日：2021-01-14

    申请人： NICHIA CORPORATION

    发明人： Tadayuki Kitajima ,  Soichiro Miura

    IPC分类号： F21V7/10 ,  H01S5/02255 ,  F21K9/64 ,  F21V13/10 ,  F21V11/16 ,  H01S5/02257 ,  H01S5/00 ,  F21Y115/30 ,  H01S5/02216 ,  H01S5/40

    摘要： A light emitting device includes: a base; a first semiconductor laser element disposed on an upper surface of the base and configured to emit first light; a first light reflecting member disposed on the upper surface of the base, the first light reflecting member having a first light reflecting face including a plane configured to reflect the first light; a second semiconductor laser element disposed on an upper surface of the base and configured to emit second light; a second light reflecting member disposed on the upper surface of the base, the second light reflecting member having a second light reflecting face including a plane configured to reflect the second light; and a phosphor member onto which the first light reflected from the first light reflecting member and the second light reflected from the second light reflecting member are irradiated.

    Method of manufacturing light emitting device, light emitting device, and base member
    6.
    发明授权
    Method of manufacturing light emitting device, light emitting device, and base member 有权

    公开(公告)号：US11303095B2

    公开(公告)日：2022-04-12

    申请号：US16791791

    申请日：2020-02-14

    申请人： NICHIA CORPORATION

    发明人： Tadayuki Kitajima ,  Tomokazu Taji

    IPC分类号： H01S5/02375 ,  H01S5/00

    摘要： A method of manufacturing a light emitting device, the method including: disposing a first semiconductor laser element on a disposition surface of a base member such that a light emission end surface of the first semiconductor laser element is parallel to a first line passing through a pair of alignment marks provided on the base member; and disposing a first light-reflective member on the disposition surface such that a reference line for the first light-reflective member, which serves as an alignment reference in disposing the first light-reflective member, is parallel to a second line that is oblique to the first line at a predetermined angle.