Invention Grant
- Patent Title: Light emitting device having heat disipation terminal arranged on substrate
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Application No.: US15975121Application Date: 2018-05-09
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Publication No.: US10193045B2Publication Date: 2019-01-29
- Inventor: Takuya Nakabayashi , Akira Hori
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Global IP Counselors, LLP
- Priority: JP2014-105728 20140521; JP2015-084046 20150416
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/64 ; H01L33/56 ; H01L33/32 ; H01L33/50 ; H01L33/60 ; H01L33/62

Abstract:
A light emitting device includes a substrate, light emitting elements, a sealing member, a light transmissive member and a heat dissipation terminal. The sealing member is in contact with at least a part of a side surface of each of the light emitting elements, is formed substantially in the same plane as the substrate, and a width of the sealing member between adjacent ones of the light emitting elements is larger than a width of the sealing member on an outside of an outermost one of the light emitting elements. The light transmissive member covers upper surfaces of the light emitting elements and a part of an upper surface of the sealing member, side surfaces of the light transmissive member being covered with the sealing member. The heat dissipation terminal is arranged generally in the center on a second main surface of the substrate and has a recess portion.
Public/Granted literature
- US20180261745A1 LIGHT EMITTING DEVICE Public/Granted day:2018-09-13
Information query
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