Invention Grant
- Patent Title: Carrier-attached copper foil, laminate, printed-wiring board and method for manufacturing the printed wiring board
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Application No.: US15039464Application Date: 2014-11-27
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Publication No.: US10201092B2Publication Date: 2019-02-05
- Inventor: Tomota Nagaura
- Applicant: JX Nippon Mining & Metals Corporation
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Nields, Lemack & Frame, LLC
- Priority: JP2013-244778 20131127; JP2014-083892 20140415
- International Application: PCT/JP2014/081468 WO 20141127
- International Announcement: WO2015/080227 WO 20150604
- Main IPC: C25D5/48
- IPC: C25D5/48 ; H05K3/20 ; B32B15/01 ; C25D1/04 ; C25D7/06 ; B32B15/20 ; C25D5/14 ; C25D3/40 ; H05K1/09 ; H05K3/00 ; H05K3/02 ; H05K3/40 ; C25D3/16 ; C25D3/38 ; C25D3/58 ; C25D9/08 ; C25D5/04
Abstract:
A carrier-attached copper foil having satisfactory circuit formability on the ultra-thin copper layer surface is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order. The ultra-thin copper layer surface has an absorbance of light at a wavelength of 400 nm is 85% or more.
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