-
公开(公告)号:US20220205124A1
公开(公告)日:2022-06-30
申请号:US17594502
申请日:2020-02-18
发明人: Takashi UENO , Mikito SUTO , Yoichiro YAMANAKA
摘要: A method of producing a surface-treated steel sheet, comprising: subjecting a steel sheet having a Sn coating or plating layer to an anodic electrolytic treatment in an alkaline aqueous solution to form a Sn oxide layer; and then subjecting the steel sheet to a cathodic electrolytic treatment in an aqueous solution containing zirconium ions to form a layer containing zirconium oxide, wherein the Sn coating or plating layer has a Sn coating weight of 0.1 g/m2 to 20.0 g/m2, the Sn oxide layer has, at a point in time when the Sn oxide layer is formed, a reduction current peak within a potential range of −800 mV to −600 mV and an electric quantity of a reduction current in the potential range of 1.5 mC/cm2 to 10.0 mC/cm2, and the layer containing zirconium oxide has a Zr coating weight of 0.1 mg/m2 to 50.0 mg/m2.
-
公开(公告)号:US11266023B2
公开(公告)日:2022-03-01
申请号:US16384327
申请日:2019-04-15
发明人: Anthony Miles , Robert Miles
IPC分类号: C25D7/06 , C25F3/02 , C25F7/00 , C25D3/34 , H05K3/07 , C25D5/34 , C25D7/00 , C25D17/00 , H01L21/3063 , H05K3/06 , C25D9/08
摘要: Electrolytic Etching/Deposition System. A system for continuous circuit fabrication comprising means for storing and dispensing the substrate, means for laminating the substrate, means for printing the substrate, means for optical inspection of the substrate, means for photolithography of the substrate, means for drying the substrate, means for developing the substrate, means for washing the substrate and means for electroplating the substrate.
-
公开(公告)号:US20210028451A1
公开(公告)日:2021-01-28
申请号:US17065670
申请日:2020-10-08
IPC分类号: H01M4/48 , H01M4/04 , C25D9/08 , C25D9/10 , C25D11/26 , H01M4/13 , H01M4/139 , H01M4/66 , H01M10/0525 , H01M10/054
摘要: The present invention provides a nanostructured metal oxide material for use as a component of an electrode in a sodium-ion battery. The material comprises a nanostructured titanium oxide film on a metal foil substrate, which can be produced by depositing or forming a nanostructured titanium dioxide material on the substrate, and then, optionally, charging and discharging the material in an electrochemical cell to improve the capacity and Coulombic efficiency thereof.
-
公开(公告)号:US20200325589A1
公开(公告)日:2020-10-15
申请号:US16379237
申请日:2019-04-09
发明人: JASON SHAW , Yifan Yan , Troy Townsend
摘要: A bathless method for plating a conductive material with composite particles or with high surface coverage. The setup for the bathless electro-plating includes a cathode, a composite mixture, a membrane, and an anode. The cathode is a conductive material. The composite mixture comprises a metal salt, an acid, and a composite material. The composite mixture is applied to the cathode. A hydrophilic membrane is applied to the composite mixture. An anode, with oxidizing properties, is applied to the membrane. A current is applied to the bathless setup. Upon removing the current and composite mixture from the cathode, a metal-based composite coating remains on the cathode.
-
公开(公告)号:US10526716B2
公开(公告)日:2020-01-07
申请号:US15101639
申请日:2014-12-04
发明人: Michael Lublow , Anna Fischer , Matthias Driess , Thomas Schedel-Niedrig , Marcel-Philip Luecke
IPC分类号: C25D9/08 , C25D5/50 , C25D7/12 , C25D3/66 , C25D5/34 , C25D5/00 , C01G49/10 , C01G51/08 , C01G53/08 , C01G3/04 , C25B11/04 , C25B1/00 , C01G49/02 , C01G51/04 , C01G53/00 , C01G53/04 , C01G3/02 , C01B33/20 , C01G51/00
摘要: The invention relates to a method for producing a metal chalcogenide thin film electrode, comprising the steps: (a) contacting a metal or metal oxide with an elementary halogen in a non-aqueous solvent, producing a metal halide compound in the solution, (b) applying a negative electric voltage to an electrically conducting or semiconducting substrate which is in contact with the solution from step (a), and (c) during and/or after step (b) contacting the substrate with an elementary chalcogen forming a metal chalcogenide layer on the substrate. The invention also relates to a metal chalcogenide thin film electrode which can be produced by the method and its use as an anode for releasing oxygen during (photo)electrochemical water splitting.
-
公开(公告)号:US10415148B2
公开(公告)日:2019-09-17
申请号:US14200546
申请日:2014-03-07
摘要: A method of treating a substrate, wherein the substrate comprises a layer deposited from a trivalent chromium electrolyte, is described. The method includes the steps of providing an anode and the chromium(III) plated substrate as a cathode in an electrolyte comprising (i) a trivalent chromium salt; and (ii) a complexant; and passing an electrical current between the anode and the cathode to passivate the chromium(III) plated substrate. The substrate may be first plated with a plated nickel layer so that the chromium(III) plated layer is deposited over the nickel plated layer.
-
公开(公告)号:US20190256994A1
公开(公告)日:2019-08-22
申请号:US16074346
申请日:2016-02-16
发明人: Hunaid B. NULWALA , John D. WATKINS , Xu ZHOU
摘要: The disclosure relates to a method for the electrodeposition of at least one metal onto a surface of a conductive substrate. In some embodiments, the electrodeposition is conducted at a temperature from about 10° C. to about 70° C., about 0.5 atm to about 5 atm, in an atmosphere comprising oxygen. In some embodiments, the method comprises electrodepositing the at least one metal via electrochemical reduction of a metal complex dissolved in a substantially aqueous medium.
-
公开(公告)号:US10332756B2
公开(公告)日:2019-06-25
申请号:US15218466
申请日:2016-07-25
发明人: Terumasa Moriyama , Tomota Nagaura
IPC分类号: B21C37/00 , H01L21/48 , C25D1/04 , H05K3/02 , H05K3/20 , H01L23/498 , H05K3/40 , H05K3/42 , C25D3/18 , C25D3/38 , C25D3/56 , C25D3/58 , C25D5/02 , C25D5/10 , C25D9/08
摘要: A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the average grain size of crystal grains that form the ultra-thin copper layer is 1.05 to 6.5 μm, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 μm.
-
公开(公告)号:US10305119B2
公开(公告)日:2019-05-28
申请号:US15109342
申请日:2015-01-22
发明人: Kazuhiro Takahashi , Taku Kagawa , Masanari Kimoto , Junko Imamura , Kiyonori Tokuno , Atsuhiko Kuroda
IPC分类号: H01M8/02 , H01M8/0228 , C25D9/08 , C22C14/00 , H01M8/0206 , H01M8/0215 , C22F1/18 , H01M8/0208 , C23C8/80 , C23G1/10 , C23C8/02 , C23C8/12 , H01M8/1018
摘要: In a titanium material or a titanium alloy material, in an oxide film formed on a surface of a titanium or a titanium alloy, the composition ratio of TiO (ITiO/(ITi+ITiO)×100 found from the maximum intensity of the X-ray diffraction peaks of TiO (ITiO) and the maximum intensity of the X-ray diffraction peaks of metal titanium (ITi) in X-ray diffraction measured at an incident angle to the surface of 0.3° is 0.5% or more. A titanium material or a titanium alloy material, and a fuel cell separator and a polymer electrolyte fuel cell having good contact-to-carbon electrical conductivity and good durability can be provided.
-
公开(公告)号:US10287700B2
公开(公告)日:2019-05-14
申请号:US12741592
申请日:2008-11-06
IPC分类号: C23C8/68 , C25D9/08 , C23C8/02 , C23C8/40 , C23C14/16 , C23C14/58 , C25D3/66 , C25D9/04 , C25D11/02 , C23C28/04 , C25D11/00
摘要: A method for producing a wear and corrosion resistant WC based material coated with one or more metals selected from group IVB, VB and VIB metals (according to CAS system) and Al is disclosed. The method comprises treating of said coated structure with electrochemical boriding treatment in an electrolyte which is substantially free of halogenated compounds wherein the electrolyte comprises alkali carbonates and boron sources and said electrolyte being heated during electrolysis under an induction heating regime having electromagnetic frequency ranging from 50 to 300 kHz during electrolysis.
-
-
-
-
-
-
-
-
-