Invention Grant
- Patent Title: Process for forming a layer of equiaxed titanium nitride and a MOSFET device having a metal gate electrode including a layer of equiaxed titanium nitride
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Application No.: US15601115Application Date: 2017-05-22
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Publication No.: US10211059B2Publication Date: 2019-02-19
- Inventor: Pierre Caubet , Florian Domengie , Carlos Augusto Suarez Segovia , Aurelie Bajolet , Onintza Ros Bengoechea
- Applicant: STMicroelectronics (Crolles 2) SAS , STMicroelectronics SA
- Applicant Address: FR Crolles FR Montrouge
- Assignee: STMicroelectronics (Crolles 2) SAS,STMicroelectronics SA
- Current Assignee: STMicroelectronics (Crolles 2) SAS,STMicroelectronics SA
- Current Assignee Address: FR Crolles FR Montrouge
- Agency: Crowe & Dunlevy
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L21/28

Abstract:
Local variability of the grain size of work function metal, as well as its crystal orientation, induces a variable work function and local variability of transistor threshold voltage. If the metal nitride for the work function metal of the transistor gate is deposited using a radio frequency physical vapor deposition, equiaxed grains are produced. The substantially equiaxed structure for the metal nitride work function metal layer (such as with TiN) reduces local variability in threshold voltage.
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