Invention Grant
- Patent Title: Apparatus and method for treating a substrate
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Application No.: US15440288Application Date: 2017-02-23
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Publication No.: US10211075B2Publication Date: 2019-02-19
- Inventor: Dae Min Kim , Soyoung Park , Muhyeon Lee
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: Semes Co., Ltd.
- Current Assignee: Semes Co., Ltd.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2016-0033909 20160322
- Main IPC: B05D1/00
- IPC: B05D1/00 ; B05D1/02 ; B05D1/34 ; B05D1/36 ; B05D3/00 ; B05D7/00 ; B08B3/00 ; B08B3/02 ; B08B3/04 ; H01L21/02 ; H01L21/67

Abstract:
An apparatus and a method for treating a substrate with liquid are disclosed. The substrate treating apparatus comprises a substrate supporting unit for supporting the substrate, a liquid supply unit for supplying a liquid to the substrate supported on the substrate supporting unit, and a controller for controlling the liquid supply unit, wherein the liquid supply unit comprises a first nozzle for supplying a first liquid and a second nozzle for supplying a second liquid, and a second area where the second liquid is supplied on the substrate is provided within a first area where the first liquid is supplied on the substrate. The first liquid and the second liquid supplied with a hydrophobic film are discharged with different ways from each other. Thereby, particles with various sizes may be removed depending on each discharge methods.
Public/Granted literature
- US20170274415A1 APPARATUS AND METHOD FOR TREATING A SUBSTRATE Public/Granted day:2017-09-28
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