公开(公告)号：US10304687B2

公开(公告)日：2019-05-28

申请号：US15655055

申请日：2017-07-20

Applicant: SEMES CO., LTD.

Inventor： Soyoung Park ,  Heehwan Kim

IPC: B08B3/02 ,  B08B3/04 ,  B08B3/08 ,  B08B3/10 ,  H01L21/02 ,  H01L21/67 ,  H01L21/304 ,  H01L21/687

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a spin head configured to support the substrate, a cup surrounding an outer circumference of the spin head, a first ejection member having a first nozzle configured to discharge a first chemical to the substrate located in the spin head, and a second ejection member having a second nozzle configured to discharge a second chemical of the same chemical composition as that of the first chemical to the substrate located in the spin head.

公开(公告)号：US10211075B2

公开(公告)日：2019-02-19

申请号：US15440288

申请日：2017-02-23

Applicant: SEMES CO., LTD.

Inventor： Dae Min Kim ,  Soyoung Park ,  Muhyeon Lee

IPC: B05D1/00 ,  B05D1/02 ,  B05D1/34 ,  B05D1/36 ,  B05D3/00 ,  B05D7/00 ,  B08B3/00 ,  B08B3/02 ,  B08B3/04 ,  H01L21/02 ,  H01L21/67

Abstract: An apparatus and a method for treating a substrate with liquid are disclosed. The substrate treating apparatus comprises a substrate supporting unit for supporting the substrate, a liquid supply unit for supplying a liquid to the substrate supported on the substrate supporting unit, and a controller for controlling the liquid supply unit, wherein the liquid supply unit comprises a first nozzle for supplying a first liquid and a second nozzle for supplying a second liquid, and a second area where the second liquid is supplied on the substrate is provided within a first area where the first liquid is supplied on the substrate. The first liquid and the second liquid supplied with a hydrophobic film are discharged with different ways from each other. Thereby, particles with various sizes may be removed depending on each discharge methods.

公开(公告)号：US20170274415A1

公开(公告)日：2017-09-28

申请号：US15440288

申请日：2017-02-23

Applicant: SEMES CO., LTD.

Inventor： Dae Min KIM ,  Soyoung Park ,  Muhyeon Lee

IPC: B05D1/02 ,  B05B9/03 ,  B05D7/00

CPC classification number: H01L21/67051 ,  B05D1/002 ,  B05D1/005 ,  B05D1/02 ,  B05D1/34 ,  B05D1/36 ,  B05D3/002 ,  B05D7/52 ,  B08B3/00 ,  B08B3/024 ,  B08B3/04 ,  H01L21/02041

Abstract: The present invention relates to an apparatus and a method for treating a substrate with liquid. The substrate treating apparatus comprises a substrate supporting unit for supporting the substrate, a liquid supply unit for supplying a liquid to the substrate supported on the substrate supporting unit, and a controller for controlling the liquid supply unit, wherein the liquid supply unit comprises a first nozzle for supplying a first liquid and a second nozzle for supplying a second liquid, and a second area where the second liquid is supplied on the substrate is provided within a first area where the first liquid is supplied on the substrate. The first liquid and the second liquid supplied with a hydrophobic film are discharged with different ways from each other. Thereby, particles with various sizes may be removed depending on each discharge methods.